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  6. Ensuring the reliability of lead-free solder and future design technologies.

Ensuring the reliability of lead-free solder and future design technologies.

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last updated:Feb 13, 2020

AndTech
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★Fundamentals and key points of reliability assessment, as well as know-how related to quality ★Clear explanations of design techniques and quality improvement points using videos

Lecturer Masahiro Satake, Representative of the Soldering Technology Center Target Audience: Researchers related to soldering Venue: Kawasaki City Education and Culture Hall, Room 3 [Kanagawa, Kawasaki] 15 minutes on foot from JR/Kyuko "Kawasaki Station" Date and Time: April 20, 2011 (Wednesday) 10:30-16:30 Capacity: 30 people *Registration will close once full. Please apply early.

    Technical Seminar
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Ensuring the reliability of lead-free solder and future design technologies.

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**Course Objectives and Goals** We have been providing extensive support for the development of lead-free solder joints, and recently we have been working towards more refined outcomes, such as the establishment of failure judgment criteria and reliability evaluation methods backed by statistical evidence. Additionally, we have obtained sufficient verification of design techniques to avoid implementation defects. In this presentation, we have made an effort to clearly explain the key points of design techniques and quality improvement using videos.

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46200

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P2

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P2

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【Program】 1. Basics of Soldering 2. Basics of Flux 3. Cross-Section Observation 4. Initial Analysis Cases through Appearance Observation 5. Future Design Technologies 5-1. What High Temperature Means for Solder 5-2. Substrate and Coefficient of Thermal Expansion 5-3. Expansion and Contraction of the Substrate during Soldering 5-4. Substrate and Copper Foil Thickness 5-5. Design Standards Required for Through-Hole Up 5-6. Design Standards Required for Zero Bridge Defects 5-7. Others (Shadow Placement) 5-8. Component Misalignment 5-9. Fillet and Lifespan 5-10. What is a “Good” Temperature Profile? 5-11. Temperature Profile from the Component Side 5-12. Temperature Profile from the Material Side 5-13. Key Points for Setting Reflow Temperature Profiles 5-14. Key Points for Setting Flow Temperature Profiles 【Business Card Exchange / Analysis Consultation】

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AndTech

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Our company has developed its business from "seminar planning" to various forms such as "lecturer dispatch," "publishing planning," "technical consultant dispatch," "trend research," "business matching," and "business development consulting," in order to support clients in a wide range of fields including chemistry, electronics, automotive, energy, medical devices, food, and building materials. By doing so, we have advanced our company and opened up new markets. AndTech promises to continue listening to our clients' voices, entering the business areas and markets they desire, and to remain a company that is loved by our clients, as we share their challenges, think together, and forge new paths.

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