Adjustable hardness, hardness, and viscosity! Suitable for a wide range of bonding including electronic components, metals, glass, and plastics.
The "Aronix UV Series" is a one-component UV-curable resin formulation based on the acrylic-based special monomer and oligomer "Aronix M Series" developed by Toa Gosei. It can be used in conjunction with heat curing as needed, allowing for curing from thick films to thin films. Additionally, it can produce cured materials that range from tough to flexible and elastic, enabling a wide selection and design of curing methods and properties of the cured products. Furthermore, due to its rapid curing under ultraviolet light, it facilitates the automation and acceleration of manufacturing processes, leading to significant cost reductions. 【Features】 ■ One-component, excellent workability ■ Cures quickly under ultraviolet light ■ Easy automation and acceleration of manufacturing processes ■ Significant cost reduction possible ■ Wide selection and design of curing methods and properties of cured materials *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Lineup】 ■ For metal and glass: "UV-3300" ■ For plastic: "UV-3600," "UV-3610" *For more details, please refer to the PDF document or feel free to contact us.
Price information
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Applications/Examples of results
【Application Fields】 ■ Wide range of bonding for electronic components, metals, glass, plastics, etc. ■ Adjustment of curing properties, hardness, and viscosity *For more details, please refer to the PDF document or feel free to contact us.
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Ultraviolet curing type adhesive "Alonix UV Series"
Company information
Toho Chemical Industry offers a range of distinctive adhesives developed through Aronalfa and proprietary technologies. To meet diverse needs from household use to industrial applications such as electronic materials, automobiles, and precision equipment, we have enhanced our lineup of high-performance adhesives, contributing to faster manufacturing and repair processes as well as cost reduction through the bonding of various materials.