Wide range of adhesion is possible with electronic components, metals, glass, plastics, etc.! Hardness, viscosity, and curing properties can be adjusted.
The "AroNix Series" is a light-curing adhesive that can bond over a wide wavelength range of ultraviolet and visible light. Starting with the visible light and ultraviolet curing type "LCR Series," we also offer the ultraviolet anaerobic curing type "BU Series" and the ultraviolet curing type "UV-3000 Series." Additionally, depending on the materials and the shape of the substrates, we have anaerobic types that can cure even in areas not exposed to ultraviolet light. 【Features】 ■ Single-component, lightweight, and no mixing required ■ Cures quickly with light ■ Reduces working time and lowers costs ■ Wide selection and design options for curing wavelengths, anaerobic properties, and cured material characteristics *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Lineup】 ■LCR Series ■BU Series ■UV-3000 Series *For more details, please refer to the PDF document or feel free to contact us.
Price information
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Applications/Examples of results
【Applications】 ■ Capable of bonding a wide range of materials including electronic components, metals, glass, and plastics ■ Suitable for joining and assembling optical components due to high transparency ■ Low shrinkage and low stress type is ideal for precision fixing ■ Hardness, viscosity, and curing properties can be adjusted *For more details, please refer to the PDF document or feel free to contact us.
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Light-curing adhesive "Alonix Series" product lineup
Company information
Toho Chemical Industry offers a range of distinctive adhesives developed through Aronalfa and proprietary technologies. To meet diverse needs from household use to industrial applications such as electronic materials, automobiles, and precision equipment, we have enhanced our lineup of high-performance adhesives, contributing to faster manufacturing and repair processes as well as cost reduction through the bonding of various materials.
