Aromite AF-700 ◆ A bonding film that combines top-class low dielectric properties and excellent adhesion in the industry. Ideal for bonding high-speed transmission substrate materials!
The "Aromite(R) AF-700 series" is a thermosetting bonding film that exhibits low dielectric properties in the high-frequency range (1-10GHz). Compared to conventional epoxy-based bonding films, it has lower dielectric constant and dielectric loss tangent, making it suitable for electronic material applications that require high frequency performance. It has good adhesion to substrates that are generally considered difficult to bond, such as polyimide and LCP, and also excels in processability during circuit board manufacturing. It has received high praise from circuit board material manufacturers and film manufacturers both domestically and internationally. It is used in mobile circuit boards, including smartphones, as well as in automotive millimeter-wave radar and antenna components for base stations.
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basic information
<Features> ■Excellent dielectric properties - It exhibits low dielectric properties in the high-frequency range (1-10 GHz). → This can reduce transmission loss in circuit boards that handle high-frequency electrical signals. - It maintains low dielectric properties even after humidity and heat treatment (85 ℃/85RH%). ■High adhesion - It shows excellent adhesion to substrates such as polyimide, LCP, COP, and low-roughness copper foil. ■High heat resistance - It has excellent heat resistance during solder reflow. ■Low water absorption - It has low moisture absorption and maintains high adhesion strength even in humidity and heat environment tests. *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Company information
Toho Chemical Industry offers a range of distinctive adhesives developed through Aronalfa and proprietary technologies. To meet diverse needs from household use to industrial applications such as electronic materials, automobiles, and precision equipment, we have enhanced our lineup of high-performance adhesives, contributing to faster manufacturing and repair processes as well as cost reduction through the bonding of various materials.
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