Development of conductive adhesives, selection of metal nanoparticles and fillers, testing methods, and standards.
S10604
Thick film circuits printed with conductive ink! Methods for selecting metal particles used as fillers and surface treatment techniques!
Speaker Part 1: Dr. Takeshi Suga, Engineering PhD, Technical Department, Fujikura Kasei Co., Ltd. Electronic Materials Division Part 2: Masayoshi Yoshitake, Technical Engineer (Metal Division), Research and Development Department, Fukuda Metal Foil Powder Industry Co., Ltd. Part 3: Hiroshi Otsuka, Emeritus Professor, Meisei University Target Audience: Researchers and personnel interested in conductive adhesives, metal nanoparticle fillers, and trends in testing standards. Venue: Kawasaki City Industrial Promotion Hall, Conference Room 1 Date and Time: June 20, 2011 (Monday) 11:00 AM - 4:00 PM Capacity: 30 people. *Please apply early as there may be a rush of applications. Participation Fee: 57,750 yen (tax included, lunch included, including text costs) for up to 2 people from one company. *Tech-Zone members who apply by June 6 will receive an early bird discount price of 52,500 yen (for up to 2 people from one company). ◆ When applying for the early bird discount, please select "1 person (early discount)" or "2 people (early discount)" in the number registration. ◆ Point discounts are not applicable to the early bird discount price. Point discount services can only be applied when applying at the regular price. ◆ For additional applications from the same organization, an additional fee of 23,100 yen per person will be charged.
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basic information
Currently, there is still no complete alternative material for lead-free solder that can replace high-temperature solder. In this context, conductive adhesives are considered usable as a substitute for high-temperature solder and for applications involving components that cannot withstand high temperatures. This presentation will report on the development trends in electronic component mounting using "Ag-based conductive adhesives" and "metal-bonded conductive adhesives." Additionally, recently, "printable electronics technology," which involves forming various electronic circuits through printing, has been attracting attention. This includes thick-film circuits printed with conductive ink (paints or pastes that disperse metal particles in a binder), which are becoming practical and are starting to be commercialized. The metal particles used as conductive fillers vary greatly in properties based on composition, shape, and surface treatment, often determining the film properties of conductive paints, pastes, and adhesives. In this lecture, I will explain the selection methods and surface treatment techniques for metal particles used as conductive fillers by application, as well as discuss the development trends of metal nanoparticles.
Price range
P2
Delivery Time
P2
Applications/Examples of results
Part 1: Trends in the Development of Conductive Adhesives ~ "Ag-based Conductive Adhesives" "Metal Bonding Conductive Adhesives" ~ Instructor: Takeshi Suga, Technical Department, Electronic Materials Division, Fujikura Kasei Co., Ltd. 1. About Conductive Adhesives 2. High Heat-Resistant Conductive Adhesives 3. Conductive Adhesives Compatible with Sn Electrodes 4. High Thermal Conductivity Conductive Adhesives 5. B-Stage Curing Conductive Adhesives 6. Metal Bonding Conductive Adhesives 7. Future Initiatives for Conductive Adhesives [Q&A] Part 2: Selection of Conductive Fillers for Conductive Paints, Pastes, and Adhesives, and Trends in the Development of Conductive Metal Nanoparticles Masayoshi Yoshitake, Fukuda Metal Foil Powder Industry Co., Ltd. 1. Powder Characteristics and Manufacturing Technology of Conductive Fillers (Silver Particles) 2. Powder Characteristics and Manufacturing Technology of Conductive Fillers (Copper Particles) 3. Other Conductive Metal Fillers 4. Trends in the Development of Metal Nanoparticles for Conductive Fillers [Q&A] Part 3: Testing Methods and Standards for High-Frequency Transmission Characteristics of Conductive Adhesives Instructor: Kanji Otsuka, Meisei University 1. What is a High-Speed Digital Signal? 2. Measurement Techniques for High-Speed Digital Signals 3. Techniques for Extracting High-Speed Transmission Characteristics at Connection Points 4. High-Frequency Characteristic Testing Standards 5. Introduction of Measurement Examples According to Standards [Q&A]
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