Measures for Nanoimprint Troubles and Improvement and Evaluation of Resin Release Properties and Curing Speed
S10621
★What are the characteristics and evaluation of UV resin? How should release agents be used? ★How can we improve to increase the aspect ratio without any troubles?
Speaker Part 1: Associate Professor Jun Taniguchi, Center for New Materials Development, Department of Electronic Engineering, Faculty of Engineering, Tokyo University of Science Part 2: Dr. Hiroto Miyake, Corporate Research Institute, Research Management Department, Daicel Chemical Industries, Ltd. Target Audience: Researchers in surface processing, including nanoimprint, optical lenses, and optical films. Venue: Tokyo Chuo City Industrial Hall, 4th Floor, Meeting Room 2 [Tokyo, Chuo Ward] 4-minute walk from Toei Asakusa Line, Higashi-Nihonbashi Station Date and Time: June 24, 2011 (Friday) 13:00-16:15 Capacity: 30 people *Registration will close once full. Please apply early. Participation Fee: 49,350 yen (including tax and textbook costs) for up to 2 participants from one company. *New members who apply for the first time by June 10 will receive an early bird discount price of 44,100 yen. ◆ When applying for the early bird discount, please select "1 person (early discount)" or "2 people (early discount)" in the participant registration. ◆ Point discounts are not applicable to the early bird discount price. Point discount services can only be applied when registering at the regular price.
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basic information
Nanoimprint technology has become capable of transferring not only to resins but also to metals, making it applicable to fields such as printed electronics. However, a problem that arises here is the adhesion of resin and other materials to the mold during demolding. This presentation will outline the troubles encountered during demolding and evaluation methods, and will provide solutions. Furthermore, nanoimprint technology is a method that allows for the easy creation of nanoscale structures by transferring nanosized patterns engraved on a mold, and it is believed to be applicable to many applications. Depending on the usage, it is also considered for use as an alternative to photolithography, and a significant market is expected in the future. However, there are many challenges that need to be overcome, and in the latter part of this presentation, we will introduce the challenges and corresponding solutions from the perspective of resin material development.
Price range
P2
Delivery Time
P2
Applications/Examples of results
Part 1: Basics and Challenges of Nanoimprint Technology - Troubles during Release and Evaluation Methods 1. Fundamentals of Nanoimprint Technology 2. Various Methods of Nanoimprint 2-1. Roll Nanoimprint 2-2. Nano Transfer Printing 3. Fundamentals of Release Issues in Nanoimprint 3-1. Types and Methods of Release Treatment 3-2. Evaluation Methods for Release Treatment 3-3. Durability Testing 4. Evaluation Methods for Release Properties Using High Aspect Ratio Molds 4-1. Methods for Fabricating High Aspect Ratio Molds 4-2. Release Treatment Methods 4-3. Evaluation of Release Properties and Results 4-4. Countermeasures for Release Issues 5. Trends in New Technologies Part 2: Challenges and Countermeasures in Resin Material Development for UV Nanoimprint 1. About Nanoimprint 2. UV Nanoimprint Resists 3. Resin Design and Concept Validation 3-1. Key to High Throughput 3-2. Mechanism of Substrate Adhesion 3-3. Improvement of Mold Release Properties 3-4. Enhancement of Curing Reactivity 4. New Developments in UV Nanoimprint Materials 4-1. Solvent Development Type Resists 5. Introduction of Recent Application Examples 6. Summary and Future Prospects
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