Fundamentals and High Functionality of High Barrier Vapor Deposition Films: Comparative Analysis of Characteristics in Development Examples
★Detailed introduction of vacuum deposition technology, ion plating technology, plasma CVD, binary deposition technology, etc.! ★Introduction of continuous vacuum deposition machines as well!
Lecturer Professor Yoshifumi Ito, Ph.D. Department of Applied Biological Chemistry, Kurume National College of Technology Target Audience: Engineers, researchers, and beginners interested in high barrier vapor deposition films Venue: Room 504, L Osaka [Osaka City] 300m west from Tenmabashi Station on the Tanimachi Subway Line and Keihan Electric Railway Date and Time: June 27, 2011 (Monday) 13:00-16:30 Capacity: 30 people *Registration will close once full. Please apply early. Participation Fee: 49,350 yen (including tax and textbook costs) for up to 2 people from one company ⇒ ◆ Invoices for 2 people can be split into 2 payments (please indicate your preference in the remarks section) *New members registering for the first time by June 13 will receive an early bird discount price of 44,100 yen ◆ If 3 people from the same corporation apply, the fee is 67,200 yen.
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basic information
Aluminum vapor-deposited film gained significant market expansion as an alternative to aluminum foil after the oil shock in the 1970s, thanks to its excellent gas barrier properties, pinhole resistance, light-blocking ability, and decorative qualities. On the other hand, transparent vapor-deposited film emerged around the time of the dioxin issue in the 1990s, stemming from the trend towards dechlorinated films, and is currently forming a large market due to its excellent gas barrier properties, transparency, retort resistance, non-metallic nature, and environmental compatibility. This paper will explain the characteristics, physical properties, and manufacturing methods of these vapor-deposited films, as well as provide a detailed explanation of vacuum deposition technology, ion plating technology, plasma CVD, binary deposition technology, and continuous vacuum deposition machines that serve as alternatives to conventional batch-type vacuum deposition machines, based on development experience at Mitsubishi Heavy Industries.
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P2
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P2
Applications/Examples of results
1. Basics of High Barrier Packaging Materials 2. Vacuum Thin Film Technology 3. Properties and Applications of Aluminum Vapor Deposition Films 4. Properties and Applications of Transparent Vapor Deposition Films 4.1 Composition of Transparent Vapor Deposition Films 4.2 Performance of Representative Transparent Vapor Deposition Films 4.3 Comparison of PVD and CVD Film Formation Processes 4.4 Comparison of PVD and CVD Film Formation 4.5 PVD Transparent Vapor Deposition Process 4.6 Relationship Between X Value of SiOx and Oxygen Permeability 4.7 Raw Gas Composition for CVD Transparent Vapor Deposition 4.8 Chemical Bonding of Substrate PET and Si in CVD 4.9 Binary Vapor Deposition Method of SiO and Al2O3 (Toyo Boeki) 4.10 Properties of Transparent Vapor Deposition Films 4.11 Tech Barrier Film (Mitsubishi Plastics) 4.12 GL Film (Toppan Printing) 4.13 Eco CR (Toyo Boeki) 4.14 IB Film (Dai Nippon Printing) 4.15 Usage Status of Transparent Vapor Deposition Films 4.16 Quality Requirements for Transparent Vapor Deposition Films by Application 4.17 Examples of Food Applications for Transparent Vapor Deposition Films 4.18 Examples of Non-Food Applications for Transparent Vapor Deposition Films 4.19 Examples of Applications in Optical and Electronic Fields 5. Environmental Issues and Vapor Deposition Films
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