High-performance and improved moldability of high heat-resistant, high thermal conductivity resin - For HEVs and electrical components.
S10622
What are the required levels of thermal conductivity and heat resistance for resins used in power devices? The densest packing method for resin fillers and the improvement of fluidity through filler treatment.
Lecturers Part 1: Professor Akio Takahashi, Graduate School of Engineering, Yokohama National University Part 2: Shigeru Koshibe, Representative Director, Aipack Co., Ltd. Part 3: Naokatsu Hisanaga, Senior Manager, Semiconductor Division, Sunyurek Co., Ltd. Target Audience: Researchers and personnel interested in the high functionality of heat-resistant resins, high thermal conductivity resins, and application examples in automotive uses. Venue: Tokyo Chuo Ward Industrial Hall, 4th Floor, Meeting Room 2 [Tokyo, Chuo Ward] 4-minute walk from Toei Asakusa Line, Higashi-Nihonbashi Station Date and Time: June 28, 2011 (Wednesday) 10:30 AM - 4:00 PM Capacity: 30 people Participation Fee: 54,600 yen (tax included, lunch included, including text costs) for up to 2 people from one company. *Tech-Zone members who apply by June 14 will receive an early bird discount price of 49,350 yen (for up to 2 people from one company). ◆ When applying for the early bird discount, please select "1 person (early discount)" or "2 people (early discount)" in the number registration. ◆ Point discounts from the early bird price do not apply. Point discount services can only be applied when applying at the regular price. ◆ For additional applications from the same corporation, an additional 12,600 yen will be charged per person.
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basic information
Power devices are a general term for semiconductor components that control electricity and power, and their performance significantly affects the consumption of electrical energy. In recent years, there has been a call for reducing energy consumption to prevent global warming, leading to increased attention on the high performance of power devices. Additionally, since power devices generate heat during operation, the materials used in them require heat resistance and heat dissipation properties. This paper discusses the development history of high heat-resistant and high heat-dissipating materials for consumer and automotive power devices, current issues, evaluation techniques for various performances, and future measures.
Price range
P2
Delivery Time
P2
Applications/Examples of results
Part 1: Design of Heat-Resistant and High Thermal Conductivity Resins Instructor: Akio Takahashi, Professor, Graduate School of Engineering, Yokohama National University Part 2: Improving Fluidity and Molding Properties of High Heat-Resistant and High Heat-Dissipating Materials Instructor: Shigeru Koshibe, President, Aipack Co., Ltd. 4. Technology for Enhancing Heat Dissipation and Fluidity of Sealing Materials for Power Devices 5. Evaluation of Sealing Materials for Power Devices 5-1. Evaluation Items and Methods; Heat Resistance, Insulation, Environmental Resistance 5-2. Long-term Reliability Evaluation; Moisture Resistance, High-Temperature Storage 6. New Heat-Dissipating Sealing Materials for Power Devices 6-1. Issues with Existing Sealing Materials 6-2. Development of New Heat-Dissipating Materials 6-3. Development of Materials for Next-Generation SiC Power Semiconductors Part 3: Development of Resins for Improving Heat Resistance and Water Resistance of Automotive Electrical Components Instructor: Naokatsu Hisanaga, Senior Manager, Semiconductor Division, Sanyu Recc Co., Ltd. 1. Market Trends for Four-Wheeled and Two-Wheeled Vehicles 2. Epoxy Resins Used in Four-Wheeled HEV/EVs 3. Examples of Use for Four-Wheeled HEV/EVs 3-1. Related to HEV/EV Inverter Units 3-2. Required Characteristics and Reliability Test Conditions 4. Other 1: Liquid Epoxy Resins 5. Polyurethane Resins Used in EFI for Two-Wheeled Vehicles
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