Smooth plating and surface treatment technology for resin and glass, and improvement of adhesion.
★Plating technology that forms fine patterns! ★What is the plating method in the UV process that does not involve etching?
Lecturer Part 1: Mr. Masaharu Sugimoto, Chief Researcher, Kanto Gakuin University Surface Engineering Research Institute, Inc. Part 2: Mr. Hiroki Ashizawa, Senior Researcher, Achilles Corporation Research and Development Headquarters Part 3: Mr. Kenichi Tsukada, Advisor, Tsukada Riken Kogyo Co., Ltd. Target Audience: Researchers and personnel interested in resin plating and adhesion improvement Venue: Tokyo Chuo Ward Industrial Hall, 4th Floor, Meeting Room 2 [Tokyo, Chuo Ward] 4-minute walk from Toei Asakusa Line, Higashi-Nihonbashi Station Date and Time: June 29, 2011 (Wednesday) 10:30 AM - 4:00 PM Capacity: 30 people *Please apply early as there may be a rush of applications. Participation Fee: 54,600 yen (including tax, lunch, and text costs) for up to 2 people from one company *Tech-Zone members who apply by June 16 will receive an early bird discount price of 49,350 yen (for up to 2 people from one company) ◆ When applying for the early bird discount, please select "1 person (early discount)" or "2 people (early discount)" in the number registration. ◆ Points discount is not applicable to the early bird discount price. Points discount services can only be applied to regular prices. ◆ For additional applications from the same organization, an additional 12,600 yen will be charged per person.
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basic information
In conventional methods, good adhesion between the substrate and the plating film is achieved by roughening the substrate through micro-order etching. However, this roughening can compromise the transparency of the substrate and cause conductor loss during circuit formation, leading to a demand for plating methods that can achieve good adhesion on smooth substrate surfaces. In this presentation, we will introduce a plating method centered around the 'UV process,' which uses UV irradiation as an alternative to etching, allowing for good adhesion on smooth surfaces without roughening the substrate, applicable to various resins and glass surfaces. Additionally, we will explain plating technology using a nano-dispersed solution of polypyrrole, a type of conductive polymer. By using this technology, we can achieve: 1) plating without etching, 2) plating on difficult-to-plate materials, and 3) direct patterning only on areas where polypyrrole is present. Furthermore, taking advantage of its fewer processing steps and the ability to plate on film materials, roll-to-roll plating becomes feasible. This presentation will cover the fundamentals and applications of these technologies.
Price information
S10611
Price range
P2
Delivery Time
P2
Applications/Examples of results
Part 1: Smoothing Plating Technology and Adhesion Improvement for Resins and Glass Instructor: Masaharu Sugimoto, Chief Researcher, Kanto Gakuin University Surface Engineering Research Institute 2. Conventional Methods 3. UV Process 3-1 Differences Between Conventional Methods and UV Process 3-2 Characteristics of UV Process 3-3 Plating Adhesion Mechanism 3-4 Introduction of Materials Applicable to UV Process 3-5 Application Case 1: Thin Film Glossy Plating on ABS Resin 3-6 Application Case 2: Smoothing Plating on Cycloolefin Polymer 3-7 Application Case 3: Smoothing Plating on Liquid Crystal Polymer 3-8 Application Case 4: Smoothing Plating on Polyimide 4. Plating Methods Using Special Films 5. Plating on Glass Part 2: New Plating Technology and Application Development Using Nano-dispersed Polypyrrole Liquid 1. Products Using Polypyrrole (PPy) 2. PPy Nano-dispersed Liquid 3. Overview of Plating Method Using PPy Nano-dispersed Liquid 4. Introduction of Application Cases 4-1 Plating on Films 4-2 Plating on 3D Molded Products 4-3 Plating on Fibers Part 3: Defect Countermeasure Technology Using Resin Plating Technology, Adhesion Improvement, and Application Development Instructor: Kenichi Tsukada, Advisor, Tsukada Riken Kogyo
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