Utilize sealing forming technology to enhance the added value and reduce costs of small electronic devices.
<Content> Hollow sealing molding refers to its characteristics, welding strength, weldability of the cable extraction part, case studies, and key points for sealing design (know-how). 【Features】 ○ Waterproof: Sealing performance (withstands internal pressure of 5 kgf) ○ Ultra-compact: No need for sealed components (screws, gaskets) ○ Reduced assembly costs: One-shot molding (labor-intensive reduction)
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The added value proposed by us at Kosof includes waterproofing, high functionality, modularization, lightweight design, and miniaturization. In particular, our hollow sealing molding technology, which fuses resins together to form a sealed space, can provide an IP67 level of waterproofing that prevents water ingress even after being submerged 1 meter underwater for 30 minutes. Furthermore, we possess cable waterproofing technology that blocks liquids from entering through the interface between the cable and the case or from within the wires, as well as technology that prevents the permeation of gases and water vapor. We can also consider miniaturization and modularization incorporating these technologies. Additionally, we support our customers' resin product development from both material and molding technology perspectives, including material selection and procurement leveraging the know-how of our resin manufacturer, the Unichika Group, as well as optimal design of molded parts based on extensive development experience in the sensor field, and narrowing down molding conditions considering quality control and productivity. Of course, we have established a comprehensive contract system that can manage everything from prototyping to molding and secondary processing, allowing us to provide development tailored to our customers' needs.