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  6. Introduction to IC Tag Encapsulation Molding Technology

Introduction to IC Tag Encapsulation Molding Technology

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last updated:Jul 19, 2012

コソフ 営業部
コソフ 営業部
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Achieves low-cost sealing without putting pressure on tag elements that are sensitive to moisture and heat.

We propose a sealing molding technology for IC tags. Utilizing stable resin adhesion, we offer structural proposals and molded products that contribute to miniaturization and lightweight design of products. 【Features】 ■Molding ... Hollow/filling molding, two-color/one-shot molding ■Waterproofing ... Airtight thermal welding ■Heat resistance ... Use of super heat-resistant engineering plastics ◎ By selecting the optimal structural design and processing method, we achieve low-cost sealing without applying stress to tag elements that are sensitive to moisture, heat, and mechanical stress. For more details, please contact us or download the catalog.

    Other machine elementsContract manufacturingOther polymer materials
封止成形a.jpg

Introduction to IC Tag Encapsulation Molding Technology

封止成形a.jpg
封止成形a.jpg
  • Related Link - http://www.unitika.co.jp/plastics/

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コソフ

コソフ 営業部

Resin/Plastic

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The added value proposed by us at Kosof includes waterproofing, high functionality, modularization, lightweight design, and miniaturization. In particular, our hollow sealing molding technology, which fuses resins together to form a sealed space, can provide an IP67 level of waterproofing that prevents water ingress even after being submerged 1 meter underwater for 30 minutes. Furthermore, we possess cable waterproofing technology that blocks liquids from entering through the interface between the cable and the case or from within the wires, as well as technology that prevents the permeation of gases and water vapor. We can also consider miniaturization and modularization incorporating these technologies. Additionally, we support our customers' resin product development from both material and molding technology perspectives, including material selection and procurement leveraging the know-how of our resin manufacturer, the Unichika Group, as well as optimal design of molded parts based on extensive development experience in the sensor field, and narrowing down molding conditions considering quality control and productivity. Of course, we have established a comprehensive contract system that can manage everything from prototyping to molding and secondary processing, allowing us to provide development tailored to our customers' needs.

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