Single PPM for Defect Rate in Implementation - Metal Mask to Achieve a Defect Rate of 0% in Implementation
Significant effects in reducing defect rates in mass production! Stabilizes the solder amount for ultra-small components and achieves high-aspect printing. ● High-density mounting ● Fine component mounting ● Ensures reliability in the component mounting process from prototyping to mass production.
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【Features】 ■ Stabilizes the amount of solder for ultra-small components, achieving high aspect ratio printing ■ Reduces defect rates in mass production (reducing solder balls, shorts, and insufficient solder) ■ Decreases variation in solder amounts on mixed boards ■ Water repellency: Improves water and oil repellency to enhance solder release 【Examples of compatible components】 ● CHIP: 0402, 0603 ● CSP: 0.3mm, 0.4mm pitch ● QFP: 0.4mm pitch ● Connectors: 0.4mm pitch ■ For more details, please contact us.
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"I always want to be a pioneer." To shape our customers' thoughts into reality, Process Lab Micron is here to help. "Based on a wide range of diverse technologies, we respond precisely to all of our customers' needs." As a top manufacturer of metal masks, our distinguishing feature is that we have continuously developed numerous industry-first technologies with our own hands. Through additive methods and laser processing, we have established new technologies one after another in the world of metal masks, building a technical framework that is "broad and deep." We offer a variety of technical options, from construction methods to support systems, responding precisely to all of our customers' requests. Additionally, to stay closely connected with our customers' sites and incorporate their genuine feedback into product development, we have built a network of bases that covers the entire country.
