Coating unit/phenomenon unit equipped. Easy switching between 2'' and 8'' wafers.
The LITHOTRAC series of automatic resist coating, developing, and baking equipment has been developed uniquely by our company to be adaptable to all areas of wafer manufacturing processes, from research and development applications to mass production. We strive for a highly flexible design that meets our customers' needs, and our design philosophy that customization of specifications is no longer a special order has received positive feedback from many customers. For more details, please contact us.
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basic information
**Main Features** - Equipped with spin coating unit/spin phenomenon unit - Easy switching for 2" to 8" wafers - Specifications proposed for various coating materials and developers - Specifications suitable for both research and development applications and mass production - Compatible with 300mm wafers and FOUP load ports **LithoTrack Lineup** - LITHOTRAC CB-50 (Fully Automatic Coater & Bake) As an option aimed at improving coating accuracy, it is possible to equip various temperature control devices such as atmosphere temperature and humidity control in the coating chamber, and resist temperature control. - LITHOTRAC DB-50 (Fully Automatic Developer & Bake) As an option aimed at improving developing accuracy, it is possible to equip various temperature control devices such as developer temperature control. - LITHOTRAC Dual-1000 (Fully Automatic Coater, Developer & Bake System) A model that combines spin coating unit and spin phenomenon unit. ● For more details, please contact us.
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Company information
Riso Tech Japan, since its establishment, has been a specialist in lithography, providing not only resist exposure/development analysis equipment, resist coaters/developers, and lithography simulators, but also evaluation of exposure/development materials for cutting-edge lithography processes. In particular, for resist processing equipment, we propose optimal specifications tailored to customer needs, adapting spin coaters, developers, bake (PEB) equipment, and film thickness measurement to various fields, ranging from development experimental equipment to fully automated production systems. For example, we offer coating equipment for various substrates such as ultra-thin silicon wafers, various compound semiconductors, quartz, sapphire, and piezoelectric substrates (SAW), including ArF resist, EB resist, high-viscosity thick-film resist, polyimide, insulating films, and wax, as well as development equipment for alkaline, inorganic, and organic materials. Additionally, we provide various process units such as HMDS treatment, vacuum bake, UV irradiation, and high-temperature bake processing.
