High-precision bake plate and high-precision cooling plate are adopted. Bake cooling.
The Manual Bake Cooling LWB series is a manual bake and cooling device that features an automatic resist coating and developing bake system, high-precision bake plates, and high-precision cooling plates found in the LITHOTRAC series. Process gas is uniformly purged onto the substrate from the inside of the upper cover, protecting the substrate from contamination during baking. Additionally, the structure prevents the outgassing generated during baking from being released into the cleanroom through uniform exhaust. It supports substrate sizes up to a maximum of 300mm in diameter and offers high performance with a high degree of freedom, accommodating irregularly shaped substrates as well. For more details, please contact us or refer to the catalog.
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basic information
【Main Features】 ○ High-performance 400℃ bake plate ○ PEB/cooling self-transport ○ HMDS baking processing function ○ Compact vacuum bake furnace APPS 【Other Features】 ○ Model LWB-03P (Manual bake and cooling device) → Allows for easy high-precision baking and high-precision cooling. A substrate transport system between baking and cooling can be installed. ○ Model LWB-03 (Manual bake device) → Enables easy high-precision baking. A high-temperature compatible version (400℃) LWB-03H is also available. ○ Model APPS-30 (Sheet-type manual HMDS processing device) → Allows for easy HMDS processing in a sheet format. ○ Model APPS-40 (Batch-type manual HMDS processing device) → Substrate carriers (8-inch carriers) can be manually set in the vacuum bake furnace for easy HMDS processing. ● For more details, please contact us or refer to the catalog.
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Applications/Examples of results
This is a high-performance proximity bake plate (hot plate) for semiconductor wafers. It can uniformly heat treat the wafer surface and is effective during pre-baking after resist coating and post-exposure baking (PEB) after exposure.
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Company information
Riso Tech Japan, since its establishment, has been a specialist in lithography, providing not only resist exposure/development analysis equipment, resist coaters/developers, and lithography simulators, but also evaluation of exposure/development materials for cutting-edge lithography processes. In particular, for resist processing equipment, we propose optimal specifications tailored to customer needs, adapting spin coaters, developers, bake (PEB) equipment, and film thickness measurement to various fields, ranging from development experimental equipment to fully automated production systems. For example, we offer coating equipment for various substrates such as ultra-thin silicon wafers, various compound semiconductors, quartz, sapphire, and piezoelectric substrates (SAW), including ArF resist, EB resist, high-viscosity thick-film resist, polyimide, insulating films, and wax, as well as development equipment for alkaline, inorganic, and organic materials. Additionally, we provide various process units such as HMDS treatment, vacuum bake, UV irradiation, and high-temperature bake processing.