★Aim for a defect rate of less than 1 ppm in domestic and overseas manufacturing sites! ★Thoroughly analyze and implement countermeasures for defects on-site to prevent the same defects from recurring!
Instructor Mr. Kazuo Kawai, Special Technical Advisor for Small and Medium Enterprises in Kyoto Prefecture / Implementation Technology Advisor Target Audience: Managers and instructors related to lead-free solder technology Venue: Tekuno Kawasaki, 5th Floor, Room 5 [Kanagawa, Kawasaki City] 8 minutes on foot from the East Exit of Tokyu Mizonokuchi Station, 8 minutes on foot from the North Exit of JR Musashi-Mizonokuchi Station Date and Time: November 22, 2011 (Tuesday) 13:00-16:30 Capacity: 30 people *Registration will close once full. Please apply early. Participation Fee [Early Bird Discount Price] 46,200 yen (tax included, including text costs) for up to 2 people per company *Limited to Tech-Zone members who apply by November 8. Membership registration is free. *After November 8, the [Regular Price] will be 49,350 yen (tax included, including text costs) for up to 2 people per company.
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basic information
【Course Purpose】 In recent mass production environments, the standardization of processes has led to a hollowing out of technology, and there is a shortage of skilled personnel due to expansion overseas, resulting in a tendency for a large number of recalls in the market. Additionally, with intense cost competition from overseas products, there is a demand for improvements in production efficiency and costs, yet the same defects continue to occur repeatedly. This time, we will introduce case studies that achieved a defect rate of less than 1 ppm using defect analysis, countermeasures, and verification experiment methods in the field.
Price range
P2
Delivery Time
P2
Applications/Examples of results
【Program】 1. Reflow 1. Role of Flux 1-1 Evaluation Methods for Flux Characteristics 1-2 Selection of Flux (Examples of Defects Caused by Thermal Characteristics of Flux) 2. Temperature Profile 2-1 Creation of Temperature Profile Far Infrared + Air Oven Air Reflow Oven 2-2 Pros and Cons of Preheat 3. Examples of Defect Countermeasures Corresponding to Temperature Profile 3-1 Causes and Countermeasures for Void Formation 3-2 Causes and Countermeasures for Side Ball Formation 3-3 Soldering of Large Components 3-4 Soldering of Low Thermal Resistance Components 3-5 Component Mounting 4. Reflow of Discrete Components 4-1 Connectors 4-2 Soldering of Low Thermal Resistance Components 5. Soldering of Special Components 5-1 High-Temperature Solder 5-2 Soldering of Fine Components (e.g., 0402 Chips) 5-3 Soldering of Heat Dissipation Substrates (Aluminum Substrates, Copper Substrates) 6. Other Substrates 6-1 BGA, QFN, etc. 7. Efficiency Improvement in Switching During Multi-Model Mounting 8. Methods for Determining Quality on Site 2. Flow 3. Retrofitting Modifications 【Q&A, Business Card Exchange】
Company information
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