★ Aiming to meet the demands for further heat dissipation in power devices and more! ★ A method for mass production of uniform polyimide microparticles with consistent particle size!
Speaker Mr. Naoki Kunimine, President of Thermal Design Lab, Inc. Target Audience: Personnel involved in heat transfer and heat dissipation related to electronic device design Venue: Kawasaki City Industrial Promotion Hall, 10th Floor, Conference Room 1 [Kanagawa, Kawasaki City] 8-minute walk from JR Kawasaki Station West Exit Date and Time: November 24, 2011 (Thursday) 10:00 AM - 4:30 PM Capacity: 30 people *Registration will close once full. Please apply early. Participation Fee: [Early Bird Discount Price] 46,200 yen (tax included, including text costs) for up to 2 people per company *Limited to Tech-Zone members who apply by November 10. Membership registration is free. *After November 10, the [Regular Price] will be 49,350 yen (tax included, including text costs) for up to 2 people per company.
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**Lecture Summary** The design of electronic devices is becoming increasingly challenging due to the miniaturization of components, the densification of circuit boards, and the resulting increase in heat density, along with the need to shorten development periods. While temperature predictions are made through analysis during the design phase, such analyses require a shape to work with. It is precisely at this initial shape design stage that thermal design should be considered an important process. Rather than relying solely on advanced simulations to identify design flaws, it is crucial to identify potential risks during the early design phase, before finalizing the shape, and to establish countermeasure strategies. This process necessitates the use of basic heat transfer equations and thermal circuit network methods to conceptually design heat dissipation pathways. In this lecture, we will train participants to predict temperatures using a simple EXCEL tool and to logically plan and concretize countermeasures based on fundamental principles.
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P2
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P2
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**Lecture Purpose** The design of electronic devices is becoming increasingly challenging due to the miniaturization of components, the densification of circuit boards, and the resulting increase in heat density, along with the need to shorten development periods. While analyses are conducted during the design phase to predict temperatures, these analyses require a shape. This initial stage of designing the shape is a crucial process where thermal design should be carried out. It is more important to identify potential risks during the early design phase, before finalizing the shape, and to establish countermeasure strategies, rather than just using advanced simulations to find design flaws. This process necessitates the use of basic heat transfer equations and thermal circuit network methods to perform the "conceptual design of heat dissipation pathways." In this lecture, we will train on how to predict temperatures using a simple EXCEL tool and logically plan and concretize countermeasures based on principles and fundamentals.
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