Fundamental and Fine Processing Correspondence in Wet Etching and Development of Advanced Material Applications
S11215
What is the cutting-edge etching for the formation of transparent electrode patterns for next-generation power device substrates, touch panels, and fine-pitch electronic components?!
**Lecturer** Mr. Kimihiko Ikeda, Head of the Implementation Materials Research Laboratory, Electronic Materials Development Research Institute, Research and Development Division, ADEKA Corporation **Target Audience** Engineers, researchers, and beginners interested in wet processes and wet etching technology **Venue** Tokyo Chuo Ward Industrial Hall, 4th Floor, Meeting Room 4 [Tokyo, Nihonbashi] 5 minutes from B4 exit via underground passage from Bakuroyokoyama Station on the Toei Shinjuku Line (Directions 2) 5 minutes from C1 exit via East Exit ticket gate from Bakurocho Station on the JR Sobu Rapid Line (Directions 3) **Date and Time** December 26, 2011 (Monday) 13:30-16:30 **Capacity** 20 participants. *Registration will close once full. Please apply early.* **Participation Fee** **[Early Bird Discount Price]** 46,200 yen (tax included, including text costs) for up to 2 participants from one company. *Limited to Tech-Zone members who apply by December 12. Membership registration is free.* *After December 12, the [Regular Price] will be 49,350 yen (tax included, including text costs) for up to 2 participants from one company.*
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basic information
**Lecture Summary** The current advancements in electronic device technology are remarkable, supported by manufacturing techniques in photofabrication across various fields such as semiconductors, electronic devices, and electronic equipment. In recent years, there has been an accelerated push for higher functionality, miniaturization, and lightweight designs, leading to significant progress in processing technologies. Consequently, there are many challenges in wet etching, which is a crucial factor in processing technology. These challenges include fine-tuning from thin films to thick films, selectivity through the formation of composite metal films, and the demand for diversity shifting from dry to wet etching due to cost reduction. This presentation will introduce the fundamental techniques of wet etching and various etching technologies that have gained attention in recent years based on specific applications.
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P2
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P2
Applications/Examples of results
**Program** 1. Application and fundamental technology of wet etching in various fields 2. Wet etching technology for printed circuit boards and package substrates 2-1. Etching using subtractive and semi-additive methods 2-2. Effects and dependencies based on various etching conditions 2-3. Anisotropic etching for fine wiring 2-4. Management technology and optimization of etching solutions 3. Etching technology for COF substrates equipped with IC drivers for LCD applications 3-1. Etching methods and roadmap for TCP 3-2. Anisotropic etching and modification technology for fine structures 3-3. Chemical management methods for mass production of etching solutions 4. Wet etching corresponding to transparent conductive films (ITO) and low-resistance electrode films 4-1. Etching characteristics based on amorphous and crystalline structures 4-2. Types of low-resistance electrode films and various etching methods corresponding to them 4-3. Challenges and performance requirements for next-generation materials 5. Wet etching for power device substrate applications and electronic devices 5-1. Pre-treatment and etching technology for AL-based applications 5-2. Etching technology for MEMS
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