There is a proven track record of use in power devices represented by power modules, die bonding, semiconductor ICs, and encapsulants.
High-purity alloys with impurities removed as much as possible are used. The vacuum refining method (DG treatment) removes dissolved gases, which are one of the causes of voids (applicable only to lead-containing alloys). There are no surface contaminants, oils, oxides, or scratches, ensuring good wettability. For product inquiries, please visit our company website. http://www.nihonhanda.com For more details about the products, please refer to the information below.
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basic information
【Features】 ○ Uses high-purity alloys with impurities minimized ○ Removes void-causing dissolved gases through vacuum refining (only applicable to lead-containing alloys) ○ No surface dirt, oil, oxides, or scratches, ensuring good wettability ○ Proven track record in high-reliability fields such as automotive and industrial equipment
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Applications/Examples of results
○ Power device die bonding ○ Semiconductor IC ○ Encapsulation material
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DG-Forming Solder
Company information
Nihon Handa was founded in 1910 (Meiji 43) by our first president, Genkichi Asami, in the downtown area of Tokyo. While contributing to the modernization of Japan's industry, we have literally walked alongside soldering. Although our progress may not be flashy, it has steadily accumulated over time to reach the height of a century, marking our 100th anniversary. We sincerely thank our customers who have supported our products for these long 100 years. The times are changing rapidly and dramatically, making it increasingly difficult to foresee the future, but we wish to take on the next 100 years with the courage we have cultivated over our 100-year history. It is said that continuity is strength, and we are determined not only to continue but also to evolve our offerings. We humbly ask for your continued guidance and encouragement in the future.