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  3. ニホンハンダ
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Electronic Components and Semiconductors
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ニホンハンダ

EstablishmentDecember 15, 1944
capital2436Ten thousand
number of employees80
addressTokyo/Sumida-ku/1-2-1 Kinshi, Arca Central 16th Floor
phone03-3624-5771
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last updated:Apr 04, 2018
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DG-Forming Solder

There is a proven track record of use in power devices represented by power modules, die bonding, semiconductor ICs, and encapsulants.

High-purity alloys with impurities removed as much as possible are used. The vacuum refining method (DG treatment) removes dissolved gases, which are one of the causes of voids (applicable only to lead-containing alloys). There are no surface contaminants, oils, oxides, or scratches, ensuring good wettability. For product inquiries, please visit our company website. http://www.nihonhanda.com For more details about the products, please refer to the information below.

  • Solder

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Low-temperature curing metal adhesive "MAX 102"

Achieving stable micro pin transfer and ejection! An adhesive with excellent thermal conductivity, electrical conductivity, and heat resistance.

"MAX102" is a low-temperature curing metal adhesive that features excellent thermal conductivity, electrical conductivity, heat resistance, and UV resistance. It also excels in transferability and dispensing, achieving stable micro pin transfer and consistent dispensing without variation. It is ideal for die bonding materials for LEDs and laser diodes. 【Features】 ■ No strength reduction at high temperatures ■ Capable of micro dispensing ■ Stable micro pin transfer achievable ■ Forms highly reliable metal joints For product inquiries, please visit our website. http://www.nihonhanda.com For more details about the product, please refer to the information below.

  • Other metal materials
  • glue
  • Solder

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Lead-free solder paste 'PF305-153TO'

BGA pillow defect countermeasure solder paste

The 【PF305-153TO】 reduces pillow defects due to two features: 1. Excellent printability and soldering to BGA pads. 2. Compatible with flux type ROL0, it has a fast wetting speed and good wetting on oxidized BGA balls. For product inquiries, please visit our website. http://www.nihonhanda.com For more details about the product, please refer to the information below.

  • EMS
  • Other semiconductors

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Lead-free dispensing solder paste "PF305-5091VO"

Ultra-fine micro-dispensing solder paste

The 【PF305-5091VO】 achieves a coating diameter of 100μm with a precision nozzle that has an inner diameter of 70μm. It maintains stable continuous discharge without variation and excellent heating droop characteristics. For product inquiries, please visit our website. http://www.nihonhanda.com For more details about the product, please refer to the information below.

  • EMS
  • Printed Circuit Board
  • Other power sources

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Lead-free dispensing solder paste "Series 207"

A wide range of options from non-halogen types to high-activity types.

The "207 Series" solder paste is optimized for dispensers. It includes a variety of pastes, starting from non-halogen to halogen-free options. 【Features】 ○ Stable continuous dispensing performance ○ A wide range of options from non-halogen types to high-activity types For product inquiries, please visit our website. http://www.nihonhanda.com For more details about the products, please refer to the information below.

  • Other consumables

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Conductive Adhesive "ECA Series"

Epoxy-based silver paste and nickel paste that cure with low-temperature heating.

The ECA series is a one-component paste-type conductive adhesive. It offers three types, mixed with metal particles "silver," "nickel," and "sintered silver" in epoxy resin. It is suitable for a wide range of fields, including high-reliability devices such as automotive and industrial equipment, consumer electronics, mobile electronic devices, and semiconductor and optical packages. For product inquiries, please visit our website. http://www.nihonhanda.com For more details about the products, please refer to the information below.

  • glue

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Non-silicone thermal conductive grease "TG200 Series"

Non-silicone, so no worries about electrical contact failure due to low molecular siloxanes.

The TG200 series is a non-silicone thermal conductive grease. It contains no volatile components such as siloxanes and has excellent heat resistance. It has a thermal conductivity of up to 6 W/m·K and a thermal resistance of 0.05 °C/W. For product inquiries, please visit our website. http://www.nihonhanda.com For more details about the product, please refer to the information below.

  • Solder
  • Lubricants

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Non-silicone thermal conductive grease 'TG320/340'

Newly added thermal conductive grease that suppresses viscosity reduction due to temperature rise.

【TG320/340】 is a thermal conductive grease that improves resistance to dripping and pump-out by suppressing viscosity reduction during temperature rise. It maintains excellent thermal conductivity characteristics even after long-term use. Being a non-silicone type, it eliminates issues such as electrical contact failure caused by low molecular siloxanes. For product inquiries, please visit our website. http://www.nihonhanda.com For more details about the product, please refer to the information below.

  • LED Module
  • Lamps and light emitting devices
  • power supply

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Low melting point lead-free solder paste for SMT "PF142-LT7TO"

A halogen-free solder paste with good wettability, despite being a Sn/Bi alloy!

The solder paste "PF142-LT7TO" is developed for Sn/Bi-based alloys. It meets halogen-free standards while ensuring good wettability. 【Features】 ○ Good wettability despite being halogen-free ○ Excellent soldering characteristics even at low-temperature reflow For more details, please contact us through our website.

  • Other consumables

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