Achieving stable micro pin transfer and ejection! An adhesive with excellent thermal conductivity, electrical conductivity, and heat resistance.
"MAX102" is a low-temperature curing metal adhesive that features excellent thermal conductivity, electrical conductivity, heat resistance, and UV resistance. It also excels in transferability and dispensing, achieving stable micro pin transfer and consistent dispensing without variation. It is ideal for die bonding materials for LEDs and laser diodes. 【Features】 ■ No strength reduction at high temperatures ■ Capable of micro dispensing ■ Stable micro pin transfer achievable ■ Forms highly reliable metal joints For product inquiries, please visit our website. http://www.nihonhanda.com For more details about the product, please refer to the information below.
Inquire About This Product
basic information
【Applications】 ■Dibond Adhesive ○LEDs, Laser Diodes Good transferability and discharge properties No degradation from ultraviolet light or heat, effective for heat dissipation ○Resin prevention type semiconductor components Prevention of adhesion failure due to outgassing contamination ■Heat Dissipation Applications ○Joining semiconductor elements of MPU and heat dissipation substrates ○Joining power devices with lead frames and heat dissipation substrates ○Modules (power element substrates, LED lighting) ■Conductive Applications ○Formation of bumps for flip chips ○Filling through-holes in substrates
Price information
Please feel free to contact us.
Applications/Examples of results
Examples of applications that utilize features such as excellent transferability, discharge properties, thermal conductivity, high heat resistance, conductivity, UV resistance, and absence of outgassing include the following: 【Applications】 ■ Die Bonding Agent ○ LED, Laser Diodes Good transferability and discharge properties No degradation from UV or heat, effective for heat dissipation ○ Resin Preventive Semiconductor Components Prevention of adhesion failure due to outgassing contamination ■ Heat Dissipation Applications ○ Bonding of semiconductor elements to heat dissipation substrates in MPUs ○ Bonding of power devices to lead frames and heat dissipation substrates ○ Modules (power element substrates, LED lighting) ■ Conductive Applications ○ Bump formation for flip chips ○ Filling through holes in substrates
catalog（1）
Download All Catalogs
Company information
Nihon Handa was founded in 1910 (Meiji 43) by our first president, Genkichi Asami, in the downtown area of Tokyo. While contributing to the modernization of Japan's industry, we have literally walked alongside soldering. Although our progress may not be flashy, it has steadily accumulated over time to reach the height of a century, marking our 100th anniversary. We sincerely thank our customers who have supported our products for these long 100 years. The times are changing rapidly and dramatically, making it increasingly difficult to foresee the future, but we wish to take on the next 100 years with the courage we have cultivated over our 100-year history. It is said that continuity is strength, and we are determined not only to continue but also to evolve our offerings. We humbly ask for your continued guidance and encouragement in the future.
![[Information] Silicone and Polyurethane Materials](https://image.mono.ipros.com/public/product/image/2001173729/IPROS14095406244641426160.png?w=280&h=280)
