Atmospheric Pressure Liquid Surface Powder Plasma Device [ASS-400]

Surface modification of powders with plasma! Improve surface wettability and mix powders and liquids that did not blend without the need for dispersants! (Video below)

This is a technology that can promote the industrialization of processes that have been difficult to commercialize due to challenges in processing time and cost in industries requiring powder treatment. KAI Semiconductor's unique atmospheric pressure powder plasma treatment offers: - Elimination of the need for surfactants, removing factors that lead to performance degradation, resulting in higher purity and higher quality materials. - Development of environmentally friendly materials by eliminating surfactants. - Significant reduction in processing time and realization of lower costs by simultaneously performing surface treatment and dispersion. - No degradation of the powder itself. - Easy re-dispersion of powders that have been treated once due to surface modification effects. These are some of its excellent features. We also accept contract processing of powders. We handle contract processing of powders below several tens of micrometers, including graphite carbon, carbon nanotubes, and fullerenes, as well as Ti, W, and SiO2. Right now!! We are holding a limited-time campaign on Ipros! We are offering free demo processing for the first 10 applicants. This is a rare opportunity to try it out! Don't miss it!

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