Minimum order quantity starts from 1 piece! Total solution for semiconductor IC test sockets: "20-layer interposer."
The "20-layer interposer" developed by FINPO ELECTRONIC is a total solution for semiconductor IC test sockets, achieving a minimum hole size of 0.3mm, a minimum line width of 2.17mil, and a minimum line spacing of 1.88mil. The minimum order quantity is available from just one piece. For more details, please download the catalog or contact us.
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basic information
【Product Information】 〇Origin: Taiwan 〇Application: Interposer 〇Number of Layers: 20 〇Substrate Material: FR-4 (TG170) 〇Copper Thickness: H/H OZ (inner); 1 OZ (outer) 〇Board Thickness: 91 mil +/- 9.1 mil 〇Minimum Hole Size: 0.3 mm 〇Plated Through Hole (PTH): +/- 2 mil 〇Non-Plated Through Hole (NPTH): +/- 1 mil 〇PTH Wall Thickness: 0.4 mil (min.) 〇Minimum Line Width: 2.17 mil 〇Minimum Line Spacing: 1.88 mil 〇Finish: Immersion Gold (Gold: 10u") 〇Impedance Control: Available 〇PGA: Via on PAD ●For more details, please download the catalog or contact us.
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Company information
FINPO ELECTRONIC was established in 1977 and is a specialized company in printed circuit boards. It is characterized by its focus on prototype printed circuit board production and pilot runs with fast lead times. Leveraging over 30 years of experience in the printed circuit board manufacturing industry, we are capable of flexible responses. In recent years, with the trend towards "lightweight, thin, short, and small" electronic devices and "multi-use" applications, FINPO has invested more funds and skilled personnel into manufacturing to provide low-cost, high-quality products tailored to customer needs, including single-sided, double-sided, multilayer, and built-up boards. We have obtained ISO 9001:2008 / UL Registered certification. We have a proven track record with many major companies, including Japan's leading companies H and T, as well as major firms from Taiwan and Europe and the United States. Please feel free to contact us.