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  5. Printed Circuit Board
  6. BigElec Fold - High Current Flexible Circuit Board - New Product

BigElec Fold - High Current Flexible Circuit Board - New Product

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BigElec Fold

last updated:May 20, 2026

山下マテリアル
山下マテリアル
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BigElec Fold - Customize flexible high-current wiring at a reasonable price.

BigElec Fold is a flexible and cost-effective high-current wiring solution that serves as an alternative to busbars and wire harnesses. ■ Features - Thin and flat printed circuit board structure - Customizable according to the desired shape and applied current of the customer - Two-layer construction allows for cost reduction and bending processing BigElec Fold emphasizes cost performance by limiting itself to a two-layer structure instead of a multi-layer one. This reduces material costs and makes bending processing easier, allowing for folding as well. BigElec Fold can connect to multiple terminals in its flat state, and by folding the wiring, it can also be accommodated in tight spaces. It can be freely designed and folded according to the application and wiring space. It realizes innovative ideas in the design field and provides excellent cost performance. BigElec Fold paves the way for the next stage of high-current wiring and meets customer expectations.

    Printed Circuit Board
IMG_4154

BigElec Fold - High Current Flexible Circuit Board - New Product

IMG_4154 2024-06-18 09_56_17 - 編集済み - 編集済み.jpg
IMG_4154 2024-06-18 09_56_17 - 編集済み - 編集済み.jpg IMG_4155 2024-06-18 09_56_17 - 編集済み.jpg IMG_4166 2024-06-18 09_56_34 - 編集済み - 編集済み (1).jpg 02761757-6f9e-4334-a80e-c0bdb74bf620.jpg spec.jpg
  • Special site - Product/service details - https://pr.mono.ipros.com/yamashita-net/product/

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basic information

■ Specifications - Wiring width: 8mm to 210mm - Total length: 30mm to 500mm - Terminal diameter: M3, M4, M5, M6, M8 (custom sizes available) - Customizable product thickness and component mounting options

Price range

P3

Delivery Time

P4

Applications/Examples of results

Coming Soon

Detailed information

  • 231a1a49-b984-42f8-b42a-a5895a4efe5a.png

    Current carrying capacity/temperature rise test conditions Equivalent to 8 layers, no bending items

  • 3063bf46-4569-48a4-ad79-ff84585743a1.png

    Test conditions for allowable current/temperature rise Equivalent to 8 layers / Folded state product

  • 278b397e-8efc-45bd-b3e7-5655c1dadb09.png

    Current carrying capacity/temperature rise test conditions Equivalent to 16 layers, no bending items

  • f10c975b-708e-4576-8696-22ca0bfbb277.png

    Current capacity/temperature rise test conditions for 16-layer equivalent products and folded state products.

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BigElec Flexible Circuit Board - New Product

BigElec Flexible Circuit Board - New Product

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山下マテリアル

山下マテリアル

Electronic Components and Semiconductors

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We are committed to contributing to daily life, society, and industry through value creation driven by materials, technology, and speed (short delivery times) as our motto. FPC can be extremely thin and flexible, allowing it to be used in even the smallest spaces. Therefore, it is utilized in various fields such as smartphones, communication devices, medical equipment, eco-cars like EVs/HVs/FCVs, autonomous driving systems, and VR/AR devices. One of our features is our ability to respond to short delivery times, with the shortest possible delivery being available from the "one-and-a-half-day course." Recently, we developed the "BigElec" FPC, which supports high current. It can be used as a substitute for busbars and harnesses, and we have also obtained a patent for it. We are dedicated to listening sincerely to the needs of our customers and society to develop and create new products, while prioritizing safety and consistently delivering high-quality products. This integrated approach strengthens our foundation for growth and maximizes corporate value. We are building a solid foothold in the ever-changing global market and are striving for continuous growth and development. Please feel free to consult with us.

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