Cross-edge microfabrication Cu-AlN-Cu submount

Achieving both high thermal conductivity and insulation! Submounts for high-power semiconductor lasers.

The "Cu-AlN-Cu submount" is a submount designed for high-power semiconductor lasers. The three-layer structure of Cu-AlN-Cu achieves both high thermal conductivity and insulation. Additionally, by optimally controlling the thickness of the Cu plating layer in terms of thermal expansion rate, it enables CTE matching with LD elements, facilitating higher power output and longer lifespan. Moreover, the design allows for a high degree of freedom in shape. 【Features】 ■ Ensures high thermal diffusion and insulation through the composite structure of Cu plating and AlN ■ Controls the coefficient of thermal expansion (CTE) ■ No pullback required at the critical edge of the LD mounting surface ■ Compatible with AuSn and AuGe solder deposition ■ Sharp edges improve the alignment of LDs ■ Thick Cu application possible (less than 100μm) *For more details, please refer to the PDF document or feel free to contact us.

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