Design and film formation technology of barrier films and improvement of transparency and barrier properties.
S20443
★Low-damage film formation technology to improve transparency and barrier properties!? ★Processing technology for barrier materials to achieve desired functions!
Venue Tekuno Kawasaki 5F, Room 5【Kanagawa, Kawasaki】 8 minutes on foot from Tokyu Mizonokuchi Station East Exit and JR Musashi-Mizonokuchi Station Date and Time April 17, 2012 (Tuesday) 10:20-16:30
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basic information
In the case of sealing films for organic EL, it is necessary to form them under conditions of transparency (for top emission), high barrier properties, low temperature (below 90°C), and low damage. We focus on the surface wave plasma CVD method, characterized by high electron density and low electron temperature, as a film formation method that meets these challenges, and introduce the results of the deposition and evaluation of SiN-based barrier films.
Price information
56700
Price range
P2
Delivery Time
P2
Applications/Examples of results
Part 1: Design and Film Production Technology of Transparent Barrier Films and Improvement of Barrier Properties [10:20–11:35] Instructor: Shimadzu Corporation Part 2: Barrier Properties and Evaluation Techniques of Polymer Films [12:25–13:40] Instructor: Yuichi Hirata, Associate Professor, Department of Applied Chemistry, Faculty of Textile Science and Technology, Shinshu University Part 3: Evaluation Techniques for Permeability and Barrier Properties in Barrier Films - Using Isobaric Method - [13:50–15:05] Instructor: Shintaro Otani, Director of Hosen Tech Co., Ltd. and Technical Consultant at Hitachi High-Technologies Corporation Part 4: Required Properties and Functional Enhancement of Barrier Film Materials [15:15–16:30] Instructor: Kyoichiro Igari, Chair of the Barrier Materials Technology Research Association (Former Director of Planning and Development, Barrier Materials Division, Kuraray)
Company information
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