Case Studies of Utilizing Thermal Design Support Tools for Electronic Devices [Measures for Miniaturization and High Performance]
By using a support tool for measures to miniaturize and enhance the performance of electronic devices, it is possible to simulate hundreds of boards equipped with components!
We are currently offering a collection of case studies utilizing the thermal design support tool "FloTHERMR" for electronic devices! 【Contents of the Case Study Collection】 ■ DENSO Utilized "FloTHERM, FloTHERM PCB," and "modeFRONTIER" to solve thermal issues for engine ECUs. ■ Lenovo Japan Thoroughly utilized FloTHERM simulations from the early stages of development. *For more details, please request the materials or view the PDF data from the download section.
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basic information
◎Various Shape Templates Specialized for Electronic Devices A large number of shape templates specific to electronic devices, such as heat sinks, fans, printed circuit boards, and package components, are included. By combining these templates using a mouse, you can easily create thermal fluid models. ◎Rich Library of Shapes and Material Properties At the time of installation, you can access over 1,000 types of libraries. Moreover, shape models for fans, heat sinks, thermal conductive sheets, etc., are registered with the model numbers published by each manufacturer, and material properties such as copper and FR4 are listed with names that are easier for designers to recognize. ◎Utilization of Semiconductor Package Models Created with FloTHERM PACK You can incorporate detailed models of semiconductor packages, two-resistor models, and DELPHI models created using FloTHERM PACK into your analysis models.
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By combining with products handled by IDAJ, such as the multi-purpose robust design optimization support tool "modeFRONTIER," we provide additional value.
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Company information
While focusing on MBD and CAE technologies and their surrounding technical areas, we specialize in building virtual products and collaborative design processes through cutting-edge digital engineering. We have formed partnerships with leading software vendors of the era to provide top-level digital engineering technologies in Japan, including solutions for thermal fluid analysis, structural analysis, electromagnetic field analysis, acoustic analysis, system simulation, optimization technologies, embedded software development environments, and simulation process data management (SPDM) solutions. We offer a comprehensive engineering environment necessary to solve the diverse and complex challenges faced by our customers. Official Blog: https://www.idaj.co.jp/blog/ IDAJ YouTube Channel: https://www.youtube.com/channel/UCGCd8pB5Lwq_noIoxpgJrrw/featured X: https://twitter.com/IDAJ_CAE Facebook: https://www.facebook.com/IDAJ.CAE