AF device for high-resolution microscope inspection of wafer chip patterns.
This is an AF device for high-resolution microscope inspection of wafer chip patterns. Even when the workpiece is moved using an electric XY stage, pattern matching inspection can always be performed with a focused image. It also has a function for auto-review image files of sample height at the optimal magnification for inspection, controlled by coordinates from file data. After inspection, a macro MAP can be displayed to confirm defect locations.
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【Features】 1. Can be combined with a loader for fully automated inspection. 2. High-precision 1.3 million pixel CCD camera with a color image file function for 6-inch surfaces. 3. Capable of comparing registered patterns for defect image file generation and macro MAP display. 4. AF does not select samples based on glass, mirrors, or patterned surfaces (compatible with overall objects). 5. Equipped with remote operation and image control functions. 6. Can inspect defect patterns such as chipping, line width defects, burrs, and foreign matter adhesion. ◎ You can view detailed specifications and more by downloading the catalog. If you are interested, please download and check the catalog.
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We will collaboratively think about and manufacture prototypes, automatic machines, and online machines for inspection equipment that supports the manufacturing and development of new technologies, tailored to your ideas and requests. We provide everything from the design and manufacturing maintenance of hardware, optical systems, and software for ordered products to after-sales service.