Low price compared to other companies without reducing measurement resolution!
We will simultaneously capture images of the edge surfaces and the top and bottom surfaces of the wafer's outer circumference to inspect for scratches, foreign objects, cracks, and chip defects. The inspection wafer is adhered, and the camera recognizes the wafer shape, such as notches and orifices, to optimize drive control. The newly developed triple optical system and integrated lighting achieve optimal illumination for image processing. The inspection time is fast, taking only 10 seconds per wafer. With external communication capabilities, it can be integrated directly into an automatic machine. For more details, please download and view the catalog.
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【Features】 1. Lower price compared to competitors without reducing measurement resolution. 2. The triple optical system enables simultaneous imaging of edge surfaces, upper surfaces, and lower surfaces with a single line camera. 3. Equipped with defect and foreign object identification functions. 4. Comprehensive inspection including the orifice area is possible. 5. Full-wafer imaging and defect review file functions. ◎ You can view detailed specifications and more by downloading the catalog. If you are interested, please download and check the catalog.
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We will collaboratively think about and manufacture prototypes, automatic machines, and online machines for inspection equipment that supports the manufacturing and development of new technologies, tailored to your ideas and requests. We provide everything from the design and manufacturing maintenance of hardware, optical systems, and software for ordered products to after-sales service.