Creation of TEG chips for implementation evaluation using techniques such as film formation, photo-etching, and plating.
At Toyowa Sangyo Co., Ltd., we create TEG chips for implementation evaluation using technologies such as film formation, photo-etching, and plating. We offer options for standard and custom products tailored to our customers' budgets and specifications. We can also accommodate small quantities. Please feel free to consult with us. Additionally, we provide back grinding processing for wafers and can handle processing for evaluation implementation boards. For more details, please contact us or refer to our catalog.
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basic information
【Features】 ○ Creation of TEG chips for evaluation using technologies such as film formation, photo-etching, and plating. ○ Selection of standard or custom products according to budget and specifications. ○ Support available for small quantities. ○ Wafer back-grinding processing is also available. ○ Processing support for evaluation mounting boards is possible. 【Standard Product Specifications (2 Types)】 ○ Work substrate: φ6″×0.625mmt Si wafer ○ Chip size: 10mm×10mm ○ Wiring material: Al-Si ○ Insulating material: Polyimide [Pad dimensions: 100μm square] ○ Passivation opening dimensions: 80μm ○ Pad pitch dimensions: 200μm [Pad dimensions: 90μm square] ○ Passivation opening dimensions: 80μm ○ Pad pitch dimensions: 100μm 【Custom Products】 ○ Designed according to requirements such as shape and design. ○ Wiring materials: Various metals such as Al, Al-Si, Al-Si-Cu, Cu, Au, etc. ○ Insulating materials: Organic films, oxide films, nitride films, etc. ● For more details, please contact us or refer to the catalog.
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Company information
In the future, as represented by MEMS, the research and development department will become indispensable in this industry, where higher precision and greater refinement are increasingly required. Our company will assist with prototyping and development using the know-how we have cultivated over many years. We look forward to inquiries from all industries, not just in the fields of electronics and optics.