TEG chip
We can offer standard and custom options to fit your budget. We also accommodate various bump processing. We will respond to your specifications for wiring materials, insulation materials, etc. Additionally, we can create from just one piece, so please feel free to consult with us.
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basic information
Our company uses technologies such as film formation, photo-etching, and plating to create TEG chips for implementation evaluation. We offer standard and custom options tailored to our customers' budgets and specifications. We can also accommodate small quantities. Please feel free to consult with us. [Standard Product Specifications] Substrate: φ6 inch × 0.625 mm thick Si wafer Chip dimensions: 10 mm × 10 mm Wiring material: AL-Si Insulating material: Polyimide PAD dimensions: 100 μm square, Passivation opening dimensions: 80 μm diameter PAD pitch dimensions: 200 μm Additionally, we have chips with the following specifications: PAD dimensions: 90 μm square, Passivation opening dimensions: 80 μm diameter PAD pitch dimensions: 100 μm [Custom Products] We will design according to your requirements for shape, design, etc. Wiring materials: Various metals such as aluminum, AL-Si, AL-Si-Cu, Au, etc. Insulating materials: Organic films, oxide films, nitride films, etc. Bumps: Gold (Au) stud bumps, electroplated bumps (Au, Ni, Cu, solder, lead-free solder) - We also support back grinding processing of wafers. - We can also process evaluation implementation boards.
Price information
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Delivery Time
Applications/Examples of results
Mainly, we supply it as a test board to the implementation technology development department. It can be utilized in fields such as equipment development and material development.
Company information
In the future, as represented by MEMS, the research and development department will become indispensable in this industry, where higher precision and greater refinement are increasingly required. Our company will assist with prototyping and development using the know-how we have cultivated over many years. We look forward to inquiries from all industries, not just in the fields of electronics and optics.
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