List of Bonding Equipment products
- classification：Bonding Equipment
1～45 item / All 175 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
Dual-head wedge bonder for high-speed, high-precision, and high-productivity lead frames.
- Bonding Equipment
Bond head replacement completed in a few minutes! Compatible with ball bonding, fine wire, and thick wire, etc.
- Bonding Equipment
A controllable current transducer and frequency that continuously monitors wire deformation.
- Bonding Equipment
Achieving high-quality bonds optimized for automotive powertrains.
- Bonding Equipment
The optimal bonding solution for the aerospace field, which requires high reliability.
- Bonding Equipment
High-precision bonding solutions that meet miniaturization needs.
- Bonding Equipment
Providing the optimal bond for high-brightness LED manufacturing.
- Bonding Equipment
Reliable bonding solutions that support the robustness of industrial robots.
- Bonding Equipment
Bonding solutions that contribute to improving productivity and reducing costs in home appliance manufacturing.
- Bonding Equipment
Providing optimal and high-quality bonding that supports multi-pin configurations.
- Bonding Equipment
Providing the ideal bond for manufacturing high-sensitivity sensors.
- Bonding Equipment
Easily connect copper wire chips with innovative laser heating.
- Bonding Equipment
Easier wedge bonding of copper wire using heating technology.
- Bonding Equipment
Expansion of productivity! The large work area allows for batch processing of multiple devices.
- Bonding Equipment
Providing optimal and high-quality bonds that correspond to high currents.
- Bonding Equipment
Providing bonds that contribute to improving durability in the renewable energy sector.
- Bonding Equipment
Providing optimal and high-quality bonds that support high-speed transmission.
- Bonding Equipment
Providing optimal adhesive for large-capacity bonding for EV batteries.
- Bonding Equipment
An innovative technology that heats the bond, making it easier to wedge bond copper wire.
- Bonding Equipment
Achieving ultra-precise dispensing through screw rotation! Extensive track record and versatility in LED/line coating/3D coating!
- Bonding Equipment
Notice of Participation in Internepcon 2018: Solder Jet Demonstration! Free Samples for the First Visitors
Dear Sir/Madam, I would like to congratulate you on the continued prosperity of your company. I sincerely appreciate your exceptional support. Our company will be exhibiting at the 47th InterNEPCON Japan, which will be held at Tokyo Big Sight from January 17 (Wednesday) to January 19 (Friday), 2015. We would like to cordially invite you to see our ultra-precision dispenser equipment and high-precision dispenser (cream solder jet). All of our employees and staff are looking forward to your visit. ◎ Exhibition Booth: E7-38 <Exhibition Details> - Cream solder jet dispenser demonstration (Sample application gifts available on a first-come, first-served basis) - Proposals and displays of optimal equipment for smartphone component mounting and automotive semiconductor applications - Business negotiation room available <Contact Information> Shinwa Co., Ltd. Mechatronics System Center Contact: Ozawa TEL: 052-739-0175 E-Mail: kenji-ozawa@shinwa-jpn.co.jp
Achieves a processing capacity of 72K UPH and high-precision bonding. Supports flip chips and various processes, contributing to improved productivity in semiconductor manufacturing.
- Bonding Equipment
Processing capacity of 60,000 units per hour. Contributes to quality assurance and productivity improvement by performing six-sided inspections of dies without reducing speed.
- Bonding Equipment
Equipped with two chromatic confocal line sensors. Achieves high-speed and high-precision dual-side thickness analysis at 2×384,000 data points per second.
- Bonding Equipment
Achieves high-resolution 3D optical measurement within a maximum range of 350×350mm². Supports extensive surface analysis with six types of sensor technologies.
- Bonding Equipment
Achieving high-speed processing of over 40,000 units per hour and high precision of less than 5μm. Supports multi-faceted assembly such as face-up and flip chip.
- Bonding Equipment
Achieving a processing capacity of 48,000 units per hour and 100% optical inspection. It robustly supports RFID inlay manufacturing, accommodating various web materials such as paper.
- Bonding Equipment
A method to triple production capacity without expanding the clean room!
- Bonding Equipment
Combining display devices with cover panels and films! Contributes to the enhancement of functionality and design.
- Bonding Equipment
- Processing Contract
Ideal for small-batch, multi-variety production and research and development! With simple operability, it is easy to mount chips and fine components. *Comprehensive catalog available.
- Bonding Equipment
It is a flip chip bonder capable of high-precision mounting with a tolerance of ±1μm (3σ). Demo tests are available.
- Bonding Equipment
Manual flip chip bonder suitable for small-scale production and various experiments.
- Bonding Equipment
Air bearing cylinder with zero friction resistance.
- Pneumatic Equipment
- Bonding Equipment
- Wafer processing/polishing equipment
Notice of Participation in the 1st [Kyushu] Semiconductor Industry Exhibition
We will be exhibiting at the "1st [Kyushu] Semiconductor Industry Exhibition" to be held on September 25 (Wednesday) and 26 (Thursday), 2024. On that day, we plan to showcase electronic devices such as remote controls and cables, as well as pneumatic control equipment made by Fujikura Composite, and our self-developed product "Tofmak Non-Stick Coating." We sincerely look forward to your visit. Event Dates: September 25 (Wed) and 26 (Thu), 2024, 10:00 AM to 5:00 PM Venue: Marine Messe Fukuoka, Hall B (Booth Number: 1-19) Organizer: [Kyushu] Semiconductor Industry Exhibition Executive Committee