Achieves a processing capacity of 72K UPH and high-precision bonding. Supports flip chips and various processes, contributing to improved productivity in semiconductor manufacturing.
The ultra-high-speed die bonder "ADAT3 XF" series for semiconductor assembly features the "DBSG" with a processing capability of 72K UPH and the "TwinRevolve DBFC" for flip chips, supporting 60K UPH, thereby improving the productivity of manufacturing lines. With an accuracy of ±15μm (3sigma) and complete traceability compliant with SECS/GEM (E142), it contributes to the automation of semiconductor backend processes and reduction of TCOO (total cost of ownership). 【Features】 ■ Processing speed of 72K UPH and high-precision positioning of ±15μm (3sigma) ■ Compatible with bonding processes such as epoxy, DAF, WBC, and flip chips ■ Die traceability management compliant with SECS/GEM and E142 *For more details, please download the PDF or feel free to contact us.
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**Merits** - Reduction of capital investment costs (CAPEX): By performing the work of three machines with one, significantly saves on cleanroom space in the factory. - Optimization of operational costs (OPEX): Reducing the number of machines decreases maintenance labor and power consumption. - Acceleration of market entry: Capable of responding to sudden demand fluctuations and increased production requests with minimal lead time. *For more details, please download the PDF or feel free to contact us.*
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Our company handles semiconductor manufacturing equipment, food-related equipment, automotive-related equipment, high-security equipment, terahertz equipment, and plant-related equipment. We continue to contribute to the creation of a healthy and safe society by importing things that did not exist in the world or things that we thought would be nice to have from excellent suppliers around the globe.
