株式会社 Found Four Product Lineup

The "ADAT3 XF DBSG" is a bonding system that breaks through the bottlenecks in the subsequent processes. This device functions as three machines in one, significantly saving cleanroom space in factories. Additionally, by reducing the number of devices, maintenance labor and power consumption can be decreased. 【Core Values】 ■ Ultra-high-speed drive technology: Achieves waste-free ultra-high-speed motion and high yield through the newly developed windmill method. ■ Multi-head and parallel processing: Innovative structure and low-load control enable simultaneous processing without sacrificing accuracy. ■ High-precision alignment: Maintains high precision while achieving ultra-high speed through a unique image recognition system. *For more details, please download the PDF or feel free to contact us.

• Bonding Equipment

In the semiconductor manufacturing industry, precise plating processes for lead frames are required to achieve high-reliability connections. Particularly in semiconductor devices that are becoming increasingly miniaturized, the uniformity and adhesion of the plating layer directly affect the product's performance and lifespan. Inadequate plating can lead to connection failures and early malfunctions, potentially compromising product reliability. Our plating equipment for lead frames is equipped with advanced German plating technology and AI-driven fully automated inspection functions to address these challenges. By reducing precious metal loss and minimizing human error, we support both cost reduction and high-quality standards. 【Usage Scenarios】 - Precise plating processes for lead frames - Optimization of precious metal usage - Automated quality control in the manufacturing process 【Benefits of Implementation】 - Improved cost efficiency through reduced precious metal loss - Lower disposal costs for defective products through full inspection - Mitigation of human error and reduction of rework - Stable quality in product supply

• Plating Equipment

This device is an inline plating system provided through a partnership between the German plating equipment supplier OTMK and Found Four. By applying 3D printing technology, the manufacturing costs of the device are kept low. Additionally, it features an intuitive operation screen (HMI) via a PLC dashboard. Furthermore, it operates an entirely automated inspection function inline using the AI system "AUGELAB," aiming to reduce rework and losses associated with human error. By conducting 100% inspections, it reduces the costs of discarding defective products and seeks high investment efficiency by minimizing precious metal losses. *For more details, please download the PDF or feel free to contact us.*

• Plating Equipment

We sell high-pressure homogenizers and high-pressure pumps from BOS Homogenisers. Our products contribute to the creation of high-quality products in a wide range of fields, including food, pharmaceuticals, and chemicals, by reducing and homogenizing the particle size of raw materials to less than 1 micron. Please feel free to contact us regarding specifications or overhauls of older models. 【Features】 ■ Supports pressures up to 1400 bar and processing capacities from 20L to 44,000L per hour ■ Achieves low TCO with water-saving, energy-efficient design and high robustness ■ Also supports overhauls and modifications of equipment, including other brands *For more details, please download the PDF or feel free to contact us.

• Homogenizer

Our company handles Coctio's bone broth and soup/sauce manufacturing equipment. We utilize animal bones generated from meat processing to automate the entire process from extraction to concentration of high-quality soups, demi-glace sauces, and extracts. Please feel free to contact us regarding specifications and implementation plans. 【Features】 ■ Automates the cooking process from roasting to extraction and concentration in a sealed environment ■ Efficiently extracts collagen and proteins to enhance value ■ Supports the production of clean label natural soups without relying on additives *For more details, please download the PDF or feel free to contact us.

• Food Processing Equipment

Regula provides strict identity verification (IDV) and identity document verification solutions for the AI era. This solution has a database of over 16,500 document templates from 254 countries and regions, supporting more than 138 languages and scripts, including Latin, Cyrillic, Arabic, and Chinese. It enables the automatic scanning of various objects such as passports, driver's licenses, visas, banknotes, and vehicle registration certificates, as well as the detection of forgery and alteration. Additionally, it features facial biometrics and liveliness detection capabilities through the "Face SDK." It analyzes AI-generated synthetic faces and the unique textures, subtle movements, and reflection artifacts of deepfakes to determine whether the individual is physically present. This contributes to preventing impersonation and reducing manual checks in account openings, various online transactions, and immigration control. **Features** - Supports over 16,500 document data from 254 countries and regions - Prevents impersonation and forgery with facial biometrics and liveliness detection - Forensic-level identification technology for detecting alterations in printed and handwritten documents, as well as spectral analysis *For more details, please download the PDF or feel free to contact us.*

• Food Processing Equipment

Regula offers the document and banknote counterfeit detection device "Regula 4308M." It precisely inspects and detects counterfeit or altered documents, banknotes, and various identification cards using high-resolution images and various optical systems. 【Features】 - Multi-faceted inspection with dual optical systems and dual filters - Document verification possible in seconds with ultra-high-resolution images and automatic processing - Advanced authenticity verification technology trusted by police forensics and forensic institutions *For more details, please download the PDF or feel free to contact us.

• Food Processing Equipment

The industrial pulse generator "EPULSUS-BM3B-12" supports a forward pulse voltage of 12kV and a peak current of 500A, assisting in processing processes on continuous production lines. 【Features】 ■ Forward pulse voltage range: up to 12kV ■ Peak current range: up to 500A ■ Output power: 9kW (three-phase input) ■ Industrial PEF system for continuous production lines ■ Designed to meet safety standard SIL 3 ■ Enclosure compliant with IP54 ■ CE mark compliant *For more details, please download the PDF or feel free to contact us.

• Other electronic parts

The high-power industrial pulse generator "EPULSUS-BM3B-24" supports a forward pulse voltage of 24kV and a peak current of 500A, assisting in the expansion of processing capacity in high-throughput production lines. 【Features】 ■ Forward pulse voltage range: up to 24kV ■ Peak current range: up to 500A ■ High-power model for high-throughput production lines ■ Supports improvements in on-site strength and increases in processing volume ■ Designed to meet safety standard SIL 3 ■ Equipped with an enclosure compliant with IP54 ■ CE mark compliant *For more details, please download the PDF or feel free to contact us.

• Other electronic parts

The biomedical pulse generator "EPULSUS-FBML1-5" supports a forward 5kV pulse voltage and a maximum current of 55A, assisting in cell research and various biomedical protocols. 【Features】 ■ General-purpose model compatible with 5kV multi-layer bipolar pulses ■ Independent 2-channel configuration for flexible control ■ High-speed operation with a rise time of less than 50ns due to SiC MOSFET technology ■ Maximum current range: up to 55A ■ Suitable for biomedical research and single-cell electroporation applications *For more details, please download the PDF or feel free to contact us.

• Other electronic parts

The multi-electrode protocol pulse generator "EPULSUS-FPM4-10" supports a forward 10kV pulse voltage and independent control of 4 channels, assisting in complex experiments and advanced research processes. 【Features】 ■ 10kV four-channel system compatible with complex multi-electrode protocols ■ Independent timing control for each channel ■ Supports bipolar asymmetric operation ■ Peak current range: up to 50A ■ Rise time: less than 100ns *For more details, please download the PDF or feel free to contact us.

• Other electronic parts

The research and pilot plant PEF system "EPULSUS-BM1A-12" supports positive direction 12kV bipolar pulses with a peak current of 250A, assisting in the verification process for laboratory and pilot studies. 【Features】 ■ 12kV / 250A bipolar pulse output ■ Output power: over 3kW (using SiC switching elements) ■ Includes batch processing and continuous processing chambers ■ Supports everything from basic research in the laboratory to pilot plant verification ■ A complete PEF system configuration that facilitates smooth prototyping and development *For more details, please download the PDF or feel free to contact us.

• Other electronic parts

The non-contact terahertz coating thickness measurement system "Irys" for the automotive industry utilizes terahertz waves to simultaneously measure the thickness of each layer of uncured paint and multilayer coatings in a non-destructive and highly accurate manner (with an accuracy of 1 micron level). Real-time analysis through monitoring control and data collection software contributes to the early detection of quality errors and the improvement of the painting process management. 【Features】 ■ Non-contact simultaneous measurement of the thickness of each layer of multilayer coatings using terahertz waves ■ Supports real-time monitoring and 3D display through data collection software ■ Assists in improving the efficiency of the painting process by reducing material waste and rework *For more details, please download the PDF or feel free to contact us.

• Coating thickness gauge

The ultra-high-speed die bonder "ADAT3 XF" series for semiconductor assembly features the "DBSG" with a processing capability of 72K UPH and the "TwinRevolve DBFC" for flip chips, supporting 60K UPH, thereby improving the productivity of manufacturing lines. With an accuracy of ±15μm (3sigma) and complete traceability compliant with SECS/GEM (E142), it contributes to the automation of semiconductor backend processes and reduction of TCOO (total cost of ownership). 【Features】 ■ Processing speed of 72K UPH and high-precision positioning of ±15μm (3sigma) ■ Compatible with bonding processes such as epoxy, DAF, WBC, and flip chips ■ Die traceability management compliant with SECS/GEM and E142 *For more details, please download the PDF or feel free to contact us.

• Bonding Equipment

The high-capacity RFID inlay die bonder "ADAT3 XF Tagliner" is equipped with a high-speed production capability of 48,000 pieces per hour, performing 100% high-resolution optical inspection throughout all processes from adhesion to die attachment, connection, and curing without compromising speed. It accommodates not only transparent materials but also opaque web materials such as paper, contributing to sustainable substrate selection. The automatic wafer exchange function eliminates manual work, supporting high productivity and quality control. 【Features】 ■ High-speed processing of 48,000 pieces per hour and support for flip chip bonding ■ Flexible design accommodating various web materials such as paper and transparent films ■ 100% high-resolution optical inspection throughout the entire processes of adhesion, connection, and curing *For more details, please download the PDF or feel free to contact us.

• Bonding Equipment

The Chip-to-Wafer assembly system 'C2W' for semiconductor assembly achieves high-speed operation with a pick-and-place speed exceeding 40,000 UPH and high-precision positioning of less than 5μm (3 Sigma). It supports die sizes from 0.2 to 10mm and allows for switching between face-up, face-down (flip chip), and embedded chip configurations within the system. It meets diverse micro-assembly requirements and contributes to improving productivity in semiconductor manufacturing and reducing TCOO. 【Features】 ■ High-speed pick-and-place exceeding 40,000 units per hour and high precision of less than 5μm ■ Supports switching between face-up and face-down configurations within the system ■ Compatible with die sizes from 0.2 to 10mm and panels up to 330×330mm *For more details, please download the PDF or feel free to contact us.

• Bonding Equipment

The high-precision non-contact surface measurement system 'CT350' supports high-resolution optical measurement and analysis over a maximum range of 350×350mm², and can be equipped with up to six different sensor technologies, including chromatic aberration confocal and 3D white light interferometers. It flexibly accommodates precise measurements at a Z-axis resolution of 0.1nm level, thin film measurements, and high-resolution image analysis, strongly supporting quality evaluation and surface shape analysis of various materials such as semiconductors and electronic components. 【Features】 ■ Wide measurement range of up to 350×350mm² and support for high-resolution optical analysis ■ Capable of accommodating up to six types of sensor technologies, including chromatic aberration confocal and interferometers ■ Achieves precise surface shape and thickness measurements with a Z-axis resolution of 0.1nm level *For more details, please download the PDF or feel free to contact us.

• Bonding Equipment

The high-precision double-sided surface and thickness measurement system 'CT600ST' is equipped with two chromatic confocal line sensors that have a measurement speed of 2 kHz, enabling high-density measurements of 2×384,000 data points per second. With a servo-driven double-sided Z-axis that has a resolution of 20 nm and a robust granite structure (2,500 kg), it achieves true TTV (total thickness variation) analysis and accurate thickness measurements while minimizing the effects of vibration. It strongly supports quality evaluation and process management of semiconductors and precision components. 【Features】 ■ Supports high-density double-sided measurements per second with two confocal line sensors ■ Achieves high-precision measurements with a double-sided Z-axis of 20 nm resolution and a 2,500 kg granite structure ■ Supports true TTV analysis and double-sided thickness analysis with a stable structure that suppresses vibrations *For more details, please download the PDF or feel free to contact us.

• Bonding Equipment

The die sorter "ADAT3 XF DS" for wafer-level CSP and micro CSP has a processing capacity of 60,000 units per hour and accommodates die sizes from 0.2×0.4mm to 5×5mm. It features the ability to automatically inspect all six sides of the die without reducing processing speed, contributing to quality control and cost reduction in subsequent processes. It supports automation in semiconductor manufacturing with programmable low-pressure pick force and automatic wafer exchange capabilities. 【Features】 - Achieves both a processing speed of 60,000 units per hour and automatic inspection of all six sides - Accommodates die sizes from 0.2×0.4mm to 5×5mm - Contributes to automation with support for 8 to 12-inch wafers and automatic exchange functionality *For more details, please download the PDF or feel free to contact us.

• Bonding Equipment

Are you facing issues such as "voids that are likely to reduce thermal conductivity and joint reliability" or "inability to uniformly bond chips and substrates of different heights"? Our product can press all components on the substrate (thermistors, IGBTs, MOSFETs, dies, chips, etc.) individually with dedicated pressure. We provide integrated bonding solutions for sintered dies and clips on DBC, DBA, AMB, and even sintered packages on heat sinks. 【Features】 ■ Silver sintering - Copper sintering ■ Micro-punch system reduces component waste ■ Ensures high performance, long lifespan, and excellent reliability for the entire package ■ Capable of pressing all components on the substrate individually with dedicated pressure *For more details, please refer to the PDF document or feel free to contact us.

• Other industrial robots

We would like to introduce the "Non-contact Multi-layer Film Thickness Inspection System" manufactured by das-nano, which utilizes terahertz technology that our company handles. This product measures the film thickness of each layer of multi-layer paint coatings non-contactly and in a single scan. It is compatible with dry, wet, and dried coatings, and we also offer a tabletop model. We can suggest rental options as well, so please feel free to contact us. 【Features】 ■ Non-destructive testing using terahertz waves ■ Adequate consideration for vibration countermeasures ■ High-speed measurement ■ Compatible with any substrate *For more details, please refer to the PDF document or feel free to contact us.

• Other measurement and measuring equipment

The "Cook Chill System" removes 70% of fat and 50% of salt using a jet processing unit while matching the taste and texture of existing full-fat and salty products. Using a conventional steam jacket can lead to long processing times that may damage sensitive ingredients. Additionally, products that are very sensitive to heat and excessive stirring may lose their taste, structure, and appearance. This product accelerates cooling through a combination of specially formulated bags and a rotary chiller, achieving a safe and extended refrigerated shelf life of up to 45 days. It enables the production of various types of convenience foods. 【Features】 ■ Very compact ■ Vacuum cooking capability ■ Rapid heating results in products with high nutritional value and improved flavor, color, and texture ■ Capable of producing various types of convenience foods *For more details, please refer to the PDF materials or feel free to contact us.

• Other food machinery

Are you concerned about "preservatives for storage" or "wanting to maintain the natural flavor of food," or "worried about the secure sealing of jars"? Our company offers the 'High Vacuum Capper' that allows vacuum cooking in glass containers. We have models available to meet demands ranging from 500 to 2200 jars per hour, and we can accommodate jar dimensions up to 106mm in diameter. If you are interested, we can send you a video, so please feel free to contact us. 【Features】 ■ High vacuum storage ■ Digital setting of vacuum level and sealing safety ■ High vacuum for a new food preservation system ■ Packaging technology for steam-sensitive products ■ Vacuum cooking in glass containers is possible *For more details, please refer to the PDF materials or feel free to contact us.

• Food Packaging Machinery
• Vacuum Packaging Machine

The "COCTIO AiOS 4300" is designed as a unit that incorporates all the essential functions for the industrial production of high-quality stocks and soups using animal bones. It includes a material input system, a steam jacketed sealed cooking system, filtration, extraction and preservation of soup, fat extraction, extraction of cooking materials from the cooking system, and a cleaning system at designated locations. Produced as a stock favored by restaurant chefs to enhance flavor and texture while reducing salt and fat content. It can be used for the production of clean label products. 【Features】 ■ Equipped with all the necessary functions to start industrial production of high-quality stocks and broths ■ Requires minimal management with consistent production ■ Very easy to operate ■ The entire unit fits within a 40m² installation area, requiring very little space around it ■ Can be used for the production of clean label products *For more details, please refer to the PDF materials or feel free to contact us.

• Other food machinery