Chip-to-Wafer System "C2W"

Achieving high-speed processing of over 40,000 units per hour and high precision of less than 5μm. Supports multi-faceted assembly such as face-up and flip chip.

The Chip-to-Wafer assembly system 'C2W' for semiconductor assembly achieves high-speed operation with a pick-and-place speed exceeding 40,000 UPH and high-precision positioning of less than 5μm (3 Sigma). It supports die sizes from 0.2 to 10mm and allows for switching between face-up, face-down (flip chip), and embedded chip configurations within the system. It meets diverse micro-assembly requirements and contributes to improving productivity in semiconductor manufacturing and reducing TCOO. 【Features】 ■ High-speed pick-and-place exceeding 40,000 units per hour and high precision of less than 5μm ■ Supports switching between face-up and face-down configurations within the system ■ Compatible with die sizes from 0.2 to 10mm and panels up to 330×330mm *For more details, please download the PDF or feel free to contact us.

Bonding Equipment