High-reliability joining technology for power electronics components! We will send a video of the equipment to those who are interested!
Are you facing issues such as "voids that are likely to reduce thermal conductivity and joint reliability" or "inability to uniformly bond chips and substrates of different heights"? Our product can press all components on the substrate (thermistors, IGBTs, MOSFETs, dies, chips, etc.) individually with dedicated pressure. We provide integrated bonding solutions for sintered dies and clips on DBC, DBA, AMB, and even sintered packages on heat sinks. 【Features】 ■ Silver sintering - Copper sintering ■ Micro-punch system reduces component waste ■ Ensures high performance, long lifespan, and excellent reliability for the entire package ■ Capable of pressing all components on the substrate individually with dedicated pressure *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Specifications】 ■Dimensions: W1400×D1600×H1600 mm ■Working Area Tool: Maximum 350mm×270mm, customizable upon request ■Maximum Clamping Force: Up to 980 kN ■Maximum Sintering Pressure: Up to 40 Mpa ■Maximum Temperature (Both Sides): 320 ℃ ■Weight: Up to 3260 Kg ■Clamping Stroke: 200 mm ■Sintering Tool: Multi-punch sintering tool ■Preheating Area: 0÷350°C, adjustable ■Post-Cooling Area: Internal cooling system ■Traceability: Database, DMC scanner ■Controllable Atmosphere: N2, forming gas, vacuum, available upon request ■Load Cell System: Available *For more details, please refer to the PDF document or feel free to contact us.*
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Applications/Examples of results
【Usage】 ■ Die attach thermal processing for power electronics packages ■ Direct bonding to substrates (DBC/DBA/AMB), clip bonding, lead frames, heat sinks, etc. *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Our company is the exclusive agent in Japan for Besi (BE Semiconductor Industries N.V.) and cyberTECHNOLOGIES (cyberTECHNOLOGIES GmbH). We provide various manufacturing equipment for semiconductor backend processes and high-resolution three-dimensional shape measurement systems. Please feel free to contact us if you have any inquiries.
