株式会社 Found Four Product Lineup

The ultra-high-speed die bonder "ADAT3 XF" series for semiconductor assembly features the "DBSG" with a processing capability of 72K UPH and the "TwinRevolve DBFC" for flip chips, supporting 60K UPH, thereby improving the productivity of manufacturing lines. With an accuracy of ±15μm (3sigma) and complete traceability compliant with SECS/GEM (E142), it contributes to the automation of semiconductor backend processes and reduction of TCOO (total cost of ownership). 【Features】 ■ Processing speed of 72K UPH and high-precision positioning of ±15μm (3sigma) ■ Compatible with bonding processes such as epoxy, DAF, WBC, and flip chips ■ Die traceability management compliant with SECS/GEM and E142 *For more details, please download the PDF or feel free to contact us.

The "ADAT3 XF DBSG" is a bonding system that breaks through the bottlenecks in the subsequent processes. This device functions as three machines in one, significantly saving cleanroom space in factories. Additionally, by reducing the number of devices, maintenance labor and power consumption can be decreased. 【Core Values】 ■ Ultra-high-speed drive technology: Achieves waste-free ultra-high-speed motion and high yield through the newly developed windmill method. ■ Multi-head and parallel processing: Innovative structure and low-load control enable simultaneous processing without sacrificing accuracy. ■ High-precision alignment: Maintains high precision while achieving ultra-high speed through a unique image recognition system. *For more details, please download the PDF or feel free to contact us.

The high-capacity RFID inlay die bonder "ADAT3 XF Tagliner" is equipped with a high-speed production capability of 48,000 pieces per hour, performing 100% high-resolution optical inspection throughout all processes from adhesion to die attachment, connection, and curing without compromising speed. It accommodates not only transparent materials but also opaque web materials such as paper, contributing to sustainable substrate selection. The automatic wafer exchange function eliminates manual work, supporting high productivity and quality control. 【Features】 ■ High-speed processing of 48,000 pieces per hour and support for flip chip bonding ■ Flexible design accommodating various web materials such as paper and transparent films ■ 100% high-resolution optical inspection throughout the entire processes of adhesion, connection, and curing *For more details, please download the PDF or feel free to contact us.

The Chip-to-Wafer assembly system 'C2W' for semiconductor assembly achieves high-speed operation with a pick-and-place speed exceeding 40,000 UPH and high-precision positioning of less than 5μm (3 Sigma). It supports die sizes from 0.2 to 10mm and allows for switching between face-up, face-down (flip chip), and embedded chip configurations within the system. It meets diverse micro-assembly requirements and contributes to improving productivity in semiconductor manufacturing and reducing TCOO. 【Features】 ■ High-speed pick-and-place exceeding 40,000 units per hour and high precision of less than 5μm ■ Supports switching between face-up and face-down configurations within the system ■ Compatible with die sizes from 0.2 to 10mm and panels up to 330×330mm *For more details, please download the PDF or feel free to contact us.

The high-precision non-contact surface measurement system 'CT350' supports high-resolution optical measurement and analysis over a maximum range of 350×350mm², and can be equipped with up to six different sensor technologies, including chromatic aberration confocal and 3D white light interferometers. It flexibly accommodates precise measurements at a Z-axis resolution of 0.1nm level, thin film measurements, and high-resolution image analysis, strongly supporting quality evaluation and surface shape analysis of various materials such as semiconductors and electronic components. 【Features】 ■ Wide measurement range of up to 350×350mm² and support for high-resolution optical analysis ■ Capable of accommodating up to six types of sensor technologies, including chromatic aberration confocal and interferometers ■ Achieves precise surface shape and thickness measurements with a Z-axis resolution of 0.1nm level *For more details, please download the PDF or feel free to contact us.

The high-precision double-sided surface and thickness measurement system 'CT600ST' is equipped with two chromatic confocal line sensors that have a measurement speed of 2 kHz, enabling high-density measurements of 2×384,000 data points per second. With a servo-driven double-sided Z-axis that has a resolution of 20 nm and a robust granite structure (2,500 kg), it achieves true TTV (total thickness variation) analysis and accurate thickness measurements while minimizing the effects of vibration. It strongly supports quality evaluation and process management of semiconductors and precision components. 【Features】 ■ Supports high-density double-sided measurements per second with two confocal line sensors ■ Achieves high-precision measurements with a double-sided Z-axis of 20 nm resolution and a 2,500 kg granite structure ■ Supports true TTV analysis and double-sided thickness analysis with a stable structure that suppresses vibrations *For more details, please download the PDF or feel free to contact us.

The die sorter "ADAT3 XF DS" for wafer-level CSP and micro CSP has a processing capacity of 60,000 units per hour and accommodates die sizes from 0.2×0.4mm to 5×5mm. It features the ability to automatically inspect all six sides of the die without reducing processing speed, contributing to quality control and cost reduction in subsequent processes. It supports automation in semiconductor manufacturing with programmable low-pressure pick force and automatic wafer exchange capabilities. 【Features】 - Achieves both a processing speed of 60,000 units per hour and automatic inspection of all six sides - Accommodates die sizes from 0.2×0.4mm to 5×5mm - Contributes to automation with support for 8 to 12-inch wafers and automatic exchange functionality *For more details, please download the PDF or feel free to contact us.

This device is an inline plating system provided through a partnership between the German plating equipment supplier OTMK and Found Four. By applying 3D printing technology, the manufacturing costs of the device are kept low. Additionally, it features an intuitive operation screen (HMI) via a PLC dashboard. Furthermore, it operates an entirely automated inspection function inline using the AI system "AUGELAB," aiming to reduce rework and losses associated with human error. By conducting 100% inspections, it reduces the costs of discarding defective products and seeks high investment efficiency by minimizing precious metal losses. *For more details, please download the PDF or feel free to contact us.*

In the semiconductor manufacturing industry, precise plating processes for lead frames are required to achieve high-reliability connections. Particularly in semiconductor devices that are becoming increasingly miniaturized, the uniformity and adhesion of the plating layer directly affect the product's performance and lifespan. Inadequate plating can lead to connection failures and early malfunctions, potentially compromising product reliability. Our plating equipment for lead frames is equipped with advanced German plating technology and AI-driven fully automated inspection functions to address these challenges. By reducing precious metal loss and minimizing human error, we support both cost reduction and high-quality standards. 【Usage Scenarios】 - Precise plating processes for lead frames - Optimization of precious metal usage - Automated quality control in the manufacturing process 【Benefits of Implementation】 - Improved cost efficiency through reduced precious metal loss - Lower disposal costs for defective products through full inspection - Mitigation of human error and reduction of rework - Stable quality in product supply