A method to triple production capacity without expanding the clean room!
The "ADAT3 XF DBSG" is a bonding system that breaks through the bottlenecks in the subsequent processes. This device functions as three machines in one, significantly saving cleanroom space in factories. Additionally, by reducing the number of devices, maintenance labor and power consumption can be decreased. 【Core Values】 ■ Ultra-high-speed drive technology: Achieves waste-free ultra-high-speed motion and high yield through the newly developed windmill method. ■ Multi-head and parallel processing: Innovative structure and low-load control enable simultaneous processing without sacrificing accuracy. ■ High-precision alignment: Maintains high precision while achieving ultra-high speed through a unique image recognition system. *For more details, please download the PDF or feel free to contact us.
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**Merits** - Reduction of capital investment costs (CAPEX): By performing the work of three machines with one, significantly saves on cleanroom space in the factory. - Optimization of operational costs (OPEX): Reducing the number of machines decreases maintenance labor and power consumption. - Acceleration of market entry: Capable of responding to sudden demand fluctuations and increased production requests with minimal lead time. *For more details, please download the PDF or feel free to contact us.*
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Our company handles semiconductor manufacturing equipment, food-related equipment, automotive-related equipment, high-security equipment, terahertz equipment, and plant-related equipment. We continue to contribute to the creation of a healthy and safe society by importing things that did not exist in the world or things that we thought would be nice to have from excellent suppliers around the globe.
