Laser Sonic Copper Wire Wedge Bonder for Semiconductor Manufacturing
LSB959
Easily connect copper wire chips with innovative laser heating.
In chip connections for semiconductor manufacturing, the trend towards miniaturization and higher density has led to a demand for bonding to chips with thinner pad thicknesses. Particularly when using copper wire, traditional bonding methods require high loads and power, which pose risks of damage to the chip and reduced yield. Our laser sonic copper wire wedge bonder is equipped with a heating function that supplies laser energy to the tip of the bond tool, making it easier to achieve wedge bonding with copper wire. The laser heating improves bondability, enabling bonding at lower loads and power, which contributes to the application on chips with thin pad thicknesses and enhances bond quality, thereby improving yield. 【Application Scenarios】 - Copper wire bonding to chips with thin pad thicknesses - Semiconductor devices requiring high-density packaging - Manufacturing lines aiming to improve yield 【Benefits of Implementation】 - Reduced damage to chips through bonding at low loads and power - Improved bond quality due to enhanced bondability - Increased yield
Inquire About This Product
basic information
【Features】 - Fully automatic wedge bonder equipped with a heating function - Supplies laser energy to the tool tip via a beam trap - Performs ultrasonic wire bonding with a laser-heated bond tool - Suppresses oxidation in the surrounding area by providing localized heating simultaneously with cooling - Enables bonding with low load and low power 【Our Strengths】 Hesse Mechatronics Japan Co., Ltd. is the Japanese subsidiary of Hesse GmbH in Germany, developing, manufacturing, and selling wedge bonders for fine wires, thick wires, and ribbons, as well as ball bonders, ultrasonic welding machines, and laser welding machines. We have delivered over 400 units in Japan and support our customers from the development stage to mass production. We can provide one-stop solutions for bonding technologies required in semiconductor manufacturing equipment and battery modules for BEVs and HEVs. Our strengths lie in our innovative technological capabilities and the application of cutting-edge technology to meet customer demands.
Price range
Delivery Time
Applications/Examples of results
Power modules for automotive and industrial use, batteries for BEVs, etc. *For more details, please refer to the PDF document or feel free to contact us.
Company information
Hesse Mechatronics Japan Co., Ltd. is a wholly-owned subsidiary of Hesse GmbH, headquartered in Paderborn, Germany. We primarily develop, manufacture, and sell fine and heavy wire wedge bonders. In Japan, we have delivered over 200 units to date (including deliveries to overseas factories of Japanese customers), and with the aim of providing better support to our Japanese customers from the development stage to mass production, we established our Japanese corporation in 2014. For any inquiries regarding wire bonding, whether it be fine wire, heavy wire, ribbon, aluminum wire, gold wire, copper wire, clad wire, or other wire materials, please feel free to contact us. Hesse GmbH is located in Paderborn, Germany. Since 1986, it has primarily manufactured and sold conveyor systems for factory automation. In 1995, it began manufacturing and selling high-performance semiconductor manufacturing equipment, and to date, it has delivered to over 280 companies and more than 1,200 units. Customers worldwide receive sales and support from our headquarters in Germany, our subsidiaries in Japan, Hong Kong, and the United States, as well as from local agents in over 30 countries.
