Hesse Mechatronics Japan Co.,Ltd. Product Lineup

We have developed an ultrasonic welding machine that achieves high-speed and high-quality welding through a high-rigidity wide-area chassis cultivated with ultrasonic wire bonding technology. ■ Fully automatic wide-area ultrasonic welding machine ■ Large area 392 mm x 870 mm ■ Capable of welding terminals, pins, copper rivets, and sockets using various sonotrode and equipment setups ■ High-precision detection of welding points through image recognition ■ Ability to set ultrasonic direction for each welding point using the θ-axis (rotational axis) ■ Wide range of ultrasonic power settings available ■ Narrow pitch deep access enabled by elongated tool shape design and high-precision image recognition ■ Achieves zero gap at the welding point through touchdown ■ Prevents damage to fragile devices with touchdown sensor control ■ Capable of programming welding settings using multiple phases ■ Ability to create parameters for each welding point

• Welding Machine
• Welding robot

There are numerous achievements in welding aluminum busbars, such as those between BEV battery modules, battery pack cells, and busbars. Utilizing the bond head technology of wire bonders developed over many years, we perform high-precision controlled touchdowns at each weld point, eliminating gaps between welding materials while ensuring 100% laser focus alignment. This allows for welding while effectively cleaning spatter and fumes. Clamps tailored to each weld point are unnecessary, and the welding head flexibly accommodates variations in height and tilt of the weld points. 【Features (excerpt)】 ■ Achieves high speed with dual heads ■ High-speed processing in a welding area that can accommodate an entire battery pack for passenger vehicles ■ Touchdown detection function ■ Maximum hold-down force of 100N ■ Maximum deep access of 94mm ■ Automatic recognition of weld points using ring lights and image processing optics ■ Ventilation function for welding spots ■ Equipped with automatic tool cleaning and automatic tool exchange functions

• Welding robot
• Welding Machine

We have extensive experience in welding copper terminals for automotive and industrial power modules, as well as welding aluminum busbars between cells and busbars in BEV battery modules. Utilizing the bond head technology of wire bonders developed over many years, we perform high-precision controlled touchdowns at each welding point, eliminating gaps between welding materials while ensuring 100% laser focus alignment. This allows for welding to be conducted while effectively cleaning spatter and fumes. There is no need for clamps tailored to each welding point, and the welding head flexibly accommodates variations in height and tilt of the welding points. 【Features (excerpt)】 ■ Touchdown detection function ■ Maximum hold-down force of 120N ■ Maximum deep access of 100 mm ■ Automatic recognition of welding points using ring lights and image processing optics ■ Ventilation function for welding spots ■ Optional air-cooled chiller available

• Welding Machine

Fully automatic wedge bonder equipped with a heating function. It supplies laser energy to the tool tip via a beam trap. By using a laser-heated bond tool for ultrasonic wire bonding, it improves joint quality. Localized heating occurs simultaneously with cooling, preventing oxidation of the surrounding area. Heating allows bonding with lower load and lower power, enabling wedge bonding of copper wire to chips with thinner pad thickness. Improved bond quality can also enhance yield.

• Bonding Equipment

The "BJ955/959" is a fully automatic thick wire wedge bonder developed for various substrates, chips, lead frames, and other products. It is possible to build a system for fully automatic or manual operation. We offer bond heads that can handle a wide range of wire sizes from 50um to 600um. 【Features (partial)】 ■ Bond head: Compatible with 50um - 600um aluminum, copper, and aluminum-copper clad ■ Improved wire handling: Reduced distance between bond head and spool ■ Optimized image recognition: Imaging with a new digital camera and flashlight ■ Bond tool calibration without the need for fixtures ■ High-precision programmable bond force actuator *For more details, please refer to the PDF materials or feel free to contact us.

• Bonding Equipment

The "BJ855" is a next-generation fully automatic fine wire bonder that expands the portfolio of existing production processes. It meets the growing demands for wire bonding and offers simplified operations through smart features such as bond head memory and chip libraries. In addition to standard equipment configurations, it is possible to provide automated transport systems optimized for individual devices. 【Features (partial)】 ■ High-performance touchdown detection with no detection delay, suitable for bonding thin substrates ■ Optimized image recognition: imaging with a new digital camera and flashlight ■ Bond tool calibration without the need for fixtures ■ Detailed loop programming configurable for each individual loop ■ Use of wear-free components with piezo technology *For more details, please refer to the PDF materials or feel free to contact us.

• Bonding Equipment

The BJ653 applies highly reliable Hesse quality and is suitable for product samples, prototype production, and small-scale manufacturing. The bond head of this product is interchangeable and supports wedge bonding, ball bonding, fine wires, thick wires, and ribbons. It accommodates both manual and automatic bonding, making it particularly suitable for quality verification in research and development, as well as in the prototype stage of products. 【Features (partial)】 ■ Bond head options compatible with commonly available wire materials ■ Use of friction-free components with piezo technology ■ Maintenance-free fresher hinge ■ Work area: X100mm, Y90mm, Z50mm ■ Optimized pattern recognition *For more details, please refer to the PDF document or feel free to contact us.

• Bonding Equipment

The high-speed fully automatic dual-head wedge bonder Bondjet BJ931 meets the latest technologies and various demands for automotive products and power semiconductors. It supports aluminum wire, copper wire, gold wire, and ribbon, and the bond head can be replaced in just a few minutes. With a robust and clean design, the industry's largest bonding area, long maintenance intervals, user-friendly software, and support features, the Bondjet BJ931 can also be equipped with Hesse Mechatronics' industry-leading process monitoring system PiQC.

• Bonding Equipment