Hesse Mechatronics Japan Co.,Ltd. Product Lineup

In the automotive industry, high reliability and productivity are required for the joining of components such as power modules for vehicles. Particularly in the joining of dissimilar materials like copper terminals, rivets, and pins, high-quality and stable welding is essential, and challenges include access to fine pitches and narrow spaces, as well as preventing damage to delicate components. Our fully automatic ultrasonic welding machine, Smart Welder, addresses these challenges and achieves fast and high-quality welding. 【Application Scenarios】 - Joining of copper terminals, rivets, and pins in vehicle power modules - Welding in areas requiring narrow pitch and deep access - Joining of delicate components 【Benefits of Implementation】 - Increased productivity through fast and high-quality component joining - Improved product reliability due to stable welding quality - Flexibility to meet diverse joining needs

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• Welding robot

In the battery industry, reliable bonding of electrodes is directly linked to the performance and safety of products. Particularly in battery modules where high output is advancing, precise joining of fine electrodes and stable operation on the production line are required. Improper bonding can lead to contact failures and overheating, potentially resulting in shortened product lifespan or accidents. Our fully automatic ultrasonic welder, Smart Welder, addresses these challenges and achieves high-quality electrode bonding. 【Application Scenarios】 - Bonding of battery electrodes - Welding of copper terminals, rivets, and pins - Manufacturing of automotive and industrial power modules 【Benefits of Implementation】 - High-speed and high-quality welding - High-precision welding point detection through image recognition - Support for narrow pitch deep access - Prevention of damage to fragile devices

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• Welding robot

In the semiconductor industry, the reliable welding of lead frames significantly affects product reliability. Particularly in semiconductor devices that require fine wiring and high-density mounting, precise and stable welding technology is essential. Improper welding can lead to electrical connection failures and reduced product lifespan. The fully automatic ultrasonic welding machine, Smart Welder, addresses these challenges by achieving high-quality lead frame welding through high-precision image recognition and flexible welding settings. 【Usage Scenarios】 - Welding of lead frames and terminals in semiconductor packaging - Welding of narrow-pitch, high-density lead frames - Welding that minimizes damage to fragile devices 【Benefits of Implementation】 - Improvement in welding quality and yield - Increased productivity and cost reduction - Adaptability to various lead frame shapes

• Welding Machine
• Welding robot

In the automotive industry, particularly in the joining of components for onboard power modules and BEV batteries, high-precision and clean welding is required. In welding applications such as aluminum busbars between cells and busbars, eliminating gaps between materials and ensuring reliable connections are essential for improving product reliability. The generation of spatter and fumes can lead to a decline in quality and deterioration of the working environment. Our fully automated laser welding machines apply years of developed bond head technology to achieve high-precision control and reliable laser focus for each welding point. While cleaning spatter and fumes, we perform high-quality welding. The absence of clamps allows for flexible adaptation to variations in the height and tilt of welding points, enabling efficient component joining. 【Application Scenarios】 - Welding between cells and busbars in BEV battery modules - Welding of copper terminals in onboard power modules - Joining of industrial power modules 【Benefits of Implementation】 - Clean welding through reduced spatter and fumes - Quality improvement through high-precision control at each welding point - Increased work efficiency due to the elimination of clamps - Flexible adaptation to variations in height and tilt

• Welding Machine

In the semiconductor packaging industry, precise bonding of tiny components is required. Especially as density increases, reliable welding technology is essential for maintaining product performance. Improper welding can lead to poor connections and reduced product lifespan. Our fully automatic laser welding machine applies years of developed bond head technology to achieve clean welding with minimized spatter and fumes through high-precision control and reliable laser focus at each welding point. This addresses the high-precision bonding needs in semiconductor packaging. 【Application Scenarios】 - Welding of copper terminals in semiconductor power modules - Welding of aluminum busbars between cells and busbars in BEV battery modules - Precision bonding of high-density mounting substrates 【Benefits of Implementation】 - Clean welding environment due to reduced spatter and fumes - Improved reliability through high-precision control at each welding point - Flexibility of the welding head to accommodate steps and tilts - Increased process efficiency by eliminating the need for clamps

• Welding Machine

In the automotive parts industry, reliable connections such as sensor wiring are required. In particular, the bonding of copper wire to chips with thin pad thickness requires high technology and precise control. Improper bonding can lead to decreased product performance and failures. Our Laser Sonic copper wire wedge bonder addresses these challenges with innovative heating technology. 【Application Scenarios】 - Wedge bonding of copper wire in sensor wiring - Bonding to chips with thin pad thickness - Improving reliability of automotive parts 【Benefits of Implementation】 - Improved bondability - Achieving bonds with low load and low power - Improved yield due to enhanced bond quality

• Bonding Equipment

In chip connections for semiconductor manufacturing, the trend towards miniaturization and higher density has led to a demand for bonding to chips with thinner pad thicknesses. Particularly when using copper wire, traditional bonding methods require high loads and power, which pose risks of damage to the chip and reduced yield. Our laser sonic copper wire wedge bonder is equipped with a heating function that supplies laser energy to the tip of the bond tool, making it easier to achieve wedge bonding with copper wire. The laser heating improves bondability, enabling bonding at lower loads and power, which contributes to the application on chips with thin pad thicknesses and enhances bond quality, thereby improving yield. 【Application Scenarios】 - Copper wire bonding to chips with thin pad thicknesses - Semiconductor devices requiring high-density packaging - Manufacturing lines aiming to improve yield 【Benefits of Implementation】 - Reduced damage to chips through bonding at low loads and power - Improved bond quality due to enhanced bondability - Increased yield

• Bonding Equipment

We have developed an ultrasonic welding machine that achieves high-speed and high-quality welding through a high-rigidity wide-area chassis cultivated with ultrasonic wire bonding technology. ■ Fully automatic wide-area ultrasonic welding machine ■ Large area 392 mm x 870 mm ■ Capable of welding terminals, pins, copper rivets, and sockets using various sonotrode and equipment setups ■ High-precision detection of welding points through image recognition ■ Ability to set ultrasonic direction for each welding point using the θ-axis (rotational axis) ■ Wide range of ultrasonic power settings available ■ Narrow pitch deep access enabled by elongated tool shape design and high-precision image recognition ■ Achieves zero gap at the welding point through touchdown ■ Prevents damage to fragile devices with touchdown sensor control ■ Capable of programming welding settings using multiple phases ■ Ability to create parameters for each welding point

• Welding Machine
• Welding robot

There are numerous achievements in welding aluminum busbars, such as those between BEV battery modules, battery pack cells, and busbars. Utilizing the bond head technology of wire bonders developed over many years, we perform high-precision controlled touchdowns at each weld point, eliminating gaps between welding materials while ensuring 100% laser focus alignment. This allows for welding while effectively cleaning spatter and fumes. Clamps tailored to each weld point are unnecessary, and the welding head flexibly accommodates variations in height and tilt of the weld points. 【Features (excerpt)】 ■ Achieves high speed with dual heads ■ High-speed processing in a welding area that can accommodate an entire battery pack for passenger vehicles ■ Touchdown detection function ■ Maximum hold-down force of 100N ■ Maximum deep access of 94mm ■ Automatic recognition of weld points using ring lights and image processing optics ■ Ventilation function for welding spots ■ Equipped with automatic tool cleaning and automatic tool exchange functions

• Welding robot
• Welding Machine

We have extensive experience in welding copper terminals for automotive and industrial power modules, as well as welding aluminum busbars between cells and busbars in BEV battery modules. Utilizing the bond head technology of wire bonders developed over many years, we perform high-precision controlled touchdowns at each welding point, eliminating gaps between welding materials while ensuring 100% laser focus alignment. This allows for welding to be conducted while effectively cleaning spatter and fumes. There is no need for clamps tailored to each welding point, and the welding head flexibly accommodates variations in height and tilt of the welding points. 【Features (excerpt)】 ■ Touchdown detection function ■ Maximum hold-down force of 120N ■ Maximum deep access of 100 mm ■ Automatic recognition of welding points using ring lights and image processing optics ■ Ventilation function for welding spots ■ Optional air-cooled chiller available

• Welding Machine

Fully automatic wedge bonder equipped with a heating function. It supplies laser energy to the tool tip via a beam trap. By using a laser-heated bond tool for ultrasonic wire bonding, it improves joint quality. Localized heating occurs simultaneously with cooling, preventing oxidation of the surrounding area. Heating allows bonding with lower load and lower power, enabling wedge bonding of copper wire to chips with thinner pad thickness. Improved bond quality can also enhance yield.

• Bonding Equipment

In the EV battery industry, especially for products with increasing capacity, reliable electrical connections are essential. In battery modules, secure bonding using thick wires or ribbons to handle high currents is crucial for maintaining product performance and ensuring safety. Improper bonding can lead to heat generation, performance degradation, and even safety issues. The fully automatic thick wire wedge bonders BJ955/BJ959/BJ985 have a proven track record for EV battery modules, achieving reliable bonding that accommodates increased capacity. 【Application Scenarios】 - Manufacturing of EV battery modules - Power devices requiring high currents - In-vehicle applications demanding high reliability 【Benefits of Implementation】 - Stable performance maintenance of large-capacity batteries - Improved efficiency through automation of the manufacturing process - Enhanced product reliability and ensured safety

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In the manufacturing of high-sensitivity sensors, precise bonding is required to accurately capture fine signals. Particularly, to maximize the performance of the sensor, it is crucial to eliminate minute misalignments and contact failures in wire bonding as much as possible. Improper bonding can lead to increased noise and signal attenuation, potentially resulting in decreased sensitivity of the sensor. Our fully automatic thick wire wedge bonders BJ955/BJ959/BJ985 achieve reliable bonding necessary for the production of high-sensitivity sensors through high-precision image recognition and stable bonding force. 【Application Scenarios】 - Manufacturing line for high-sensitivity sensors - Bonding of electronic components requiring fine signal transmission - Product development where quality stability is important 【Benefits of Implementation】 - Reduced risk of sensor sensitivity decline - Improved product reliability - Achieving stable productivity

• Bonding Equipment

In the semiconductor packaging industry, as the trend towards multi-pin configurations progresses, there is a demand for high-density and highly reliable bonding. Particularly when connecting numerous leads or chips, precise positioning and stable joints are directly linked to the product's performance and durability. Improper bonding can lead to signal degradation or product failure. The fully automatic thick wire wedge bonders BJ955/BJ959/BJ985 were developed to meet these needs. 【Application Scenarios】 - Manufacturing of semiconductor packages with increasing pin counts - Bonding of substrates for automotive applications - Connections to large substrates such as battery modules - Manufacturing of electronic components requiring high-density mounting 【Benefits of Implementation】 - Supports a wide range of wire sizes to meet the demands of multi-pin configurations - Accurate bonding through high-speed and high-precision image recognition - Reduced setup time due to automatic calibration features - Reliability backed by extensive track record in EV battery modules

• Bonding Equipment

In the home appliance industry, there is a growing demand for reliable and precise joining technologies due to the miniaturization and high performance of products. In particular, improving efficiency and reducing costs on production lines are critical challenges for maintaining competitiveness. Improper joining can lead to increased product defect rates and higher repair costs. The fully automatic thick wire wedge bonder BJ955/BJ959/BJ985 addresses these challenges and contributes to productivity improvement and cost reduction by achieving stable, high-quality bonding. 【Application Scenarios】 - PCB assembly for small home appliances - Component joining for high-functionality home appliances - Efficiency improvement through automation of production lines - Flexible production accommodating diverse materials 【Benefits of Implementation】 - Cost reduction through decreased defect rates - Shorter delivery times due to increased production speed - Reduced burden on operators and improved productivity - Strengthened capability to accommodate a wide range of product lineups

• Bonding Equipment

In the field of industrial robots, stable operation in harsh environments and long-term reliability are required. In particular, strong bonding that can withstand vibrations and shocks is essential for the connections of robot arms and sensor components. Insufficient bonding can lead to malfunctions and failures, posing a risk of halting the entire production line. Our fully automatic thick wire wedge bonders BJ955/BJ959/BJ985 have been developed to meet the stringent demands of industrial robots. They achieve reliable bonding to various substrates, chips, and lead frames, contributing to the robustness and reliability of robots. 【Application Scenarios】 - Sensor connections for industrial robot arms - Wiring for joints subjected to high loads - Mounting electronic components in environments with high vibrations and shocks 【Benefits of Implementation】 - Improved operational stability and reliability of robots - Reduced maintenance frequency and downtime - Long-term performance maintenance in harsh environments

• Bonding Equipment

In the telecommunications equipment industry, reliable bonding technology is required to achieve high-speed and stable signal transmission. Particularly in components that handle high-frequency signals, the quality of fine connections directly affects communication speed and stability. Improper bonding can lead to signal attenuation and noise generation, potentially resulting in decreased communication performance. Our fully automatic fine wire wedge bonders BJ955/BJ959/BJ985 address these challenges and provide high-quality bonds. 【Application Scenarios】 - Manufacturing high-speed communication modules - Wiring for high-density mounted circuit boards - Bonding of RF components 【Benefits of Implementation】 - Improved high-speed transmission performance - Stabilization of signal quality - Enhanced product reliability

• Bonding Equipment

In the field of renewable energy, long-term reliability and durability under harsh conditions are required. Particularly in components such as solar power generation panels and battery storage systems, secure and robust bonding is essential for maintaining product performance and longevity. Improper bonding can lead to performance degradation and early failure, potentially increasing maintenance costs. Our fully automatic fine wire wedge bonders BJ955/BJ959/BJ985 address these challenges and achieve reliable bonding. 【Application Scenarios】 - Connections in solar power generation panels - Internal wiring of battery modules - Component bonding in power conditioners 【Benefits of Implementation】 - Improved long-term reliability of products - Maintenance of performance under harsh conditions - Reduction in maintenance costs

• Bonding Equipment

In the manufacturing of high-brightness LED lighting, reliable electrical connections are directly linked to product performance. In particular, for thick wire bonding that handles large currents, secure bonding is essential, as it affects the brightness and lifespan of the LED. Inadequate bonding can lead to heat generation and performance degradation. Our fully automatic thick wire wedge bonders BJ955/BJ959/BJ985 accommodate a wide range of wire sizes and achieve stable bonding, contributing to the maintenance of high-brightness LED quality. 【Application Scenarios】 - Connection of high-brightness LED chips to lead frames - Manufacturing of LED modules for large current applications - Mass production lines for LED lighting products 【Benefits of Implementation】 - Reduced risk of LED brightness degradation - Improved product reliability - Enhanced production efficiency

• Bonding Equipment

In the field of power electronics, reliable bonding is required to safely and efficiently transmit high currents. Particularly in applications that demand high output, such as EV battery modules and power modules, secure bonding using thick wires or ribbons is essential. Insufficient bonding can lead to heat generation, performance degradation, and even failure. Our fully automatic thick wire wedge bonders BJ955/BJ959/BJ985 address these challenges and achieve stable bonding. 【Application Scenarios】 - EV/HEV battery modules - Power modules - Inverters - Motors 【Benefits of Implementation】 - Reliable bonding that accommodates high currents - Maintenance of product performance and increased longevity - Improved production efficiency

• Bonding Equipment

In the medical device industry, there is a demand for miniaturization of products and high reliability. In particular, the precise joining of fine components is essential for maintaining the performance and safety of the devices. Improper joining can lead to device failure or performance degradation. Our fully automatic fine wire wedge bonders BJ955/BJ959/BJ985 address these challenges and contribute to the miniaturization and high precision of medical devices. 【Application Scenarios】 - Circuit board assembly for small medical devices - Joining of fine components such as catheters and sensors - Manufacturing of implantable devices 【Benefits of Implementation】 - Support for miniaturization design of products - Improved reliability through high-precision bonding - Enhanced production efficiency

• Bonding Equipment

In the aerospace field, reliable and stable bonding technology is essential for the manufacturing of components that require extremely high reliability. In particular, products that must withstand harsh environments demand precise bonding where even minute defects are unacceptable. Our fully automatic fine wire wedge bonders BJ955/BJ959/BJ985 provide advanced bonding solutions to meet these stringent requirements. 【Application Scenarios】 - Manufacturing of electronic devices for aircraft - Joining of components for space equipment - Assembly of sensors that require high reliability 【Benefits of Implementation】 - Improved reliability of joints - Stabilization of the manufacturing process - Strengthening of quality control

• Bonding Equipment

In the automotive powertrain field, the bonding of components that require high reliability and durability is essential. Particularly in onboard applications and battery modules used in harsh environments, reliable and stable bonding directly impacts the maintenance of product performance. Inadequate bonding can lead to component failures, performance degradation, and even issues related to the overall reliability of the vehicle. Our fully automatic fine wire wedge bonders BJ955/BJ959/BJ985 have been developed to meet these demands. 【Application Scenarios】 - Wiring bonding for onboard applications - Busbar connections within battery modules - Lead frame connections in power modules 【Benefits of Implementation】 - Improved product lifespan through reliable bonding - Enhanced overall vehicle reliability through stable performance maintenance - Increased production efficiency through automation

• Bonding Equipment

The "BJ955/959" is a fully automatic thick wire wedge bonder developed for various substrates, chips, lead frames, and other products. It is possible to build a system for fully automatic or manual operation. We offer bond heads that can handle a wide range of wire sizes from 50um to 600um. 【Features (partial)】 ■ Bond head: Compatible with 50um - 600um aluminum, copper, and aluminum-copper clad ■ Improved wire handling: Reduced distance between bond head and spool ■ Optimized image recognition: Imaging with a new digital camera and flashlight ■ Bond tool calibration without the need for fixtures ■ High-precision programmable bond force actuator *For more details, please refer to the PDF materials or feel free to contact us.

• Bonding Equipment

The "BJ855" is a next-generation fully automatic fine wire bonder that expands the portfolio of existing production processes. It meets the growing demands for wire bonding and offers simplified operations through smart features such as bond head memory and chip libraries. In addition to standard equipment configurations, it is possible to provide automated transport systems optimized for individual devices. 【Features (partial)】 ■ High-performance touchdown detection with no detection delay, suitable for bonding thin substrates ■ Optimized image recognition: imaging with a new digital camera and flashlight ■ Bond tool calibration without the need for fixtures ■ Detailed loop programming configurable for each individual loop ■ Use of wear-free components with piezo technology *For more details, please refer to the PDF materials or feel free to contact us.

• Bonding Equipment

The BJ653 applies highly reliable Hesse quality and is suitable for product samples, prototype production, and small-scale manufacturing. The bond head of this product is interchangeable and supports wedge bonding, ball bonding, fine wires, thick wires, and ribbons. It accommodates both manual and automatic bonding, making it particularly suitable for quality verification in research and development, as well as in the prototype stage of products. 【Features (partial)】 ■ Bond head options compatible with commonly available wire materials ■ Use of friction-free components with piezo technology ■ Maintenance-free fresher hinge ■ Work area: X100mm, Y90mm, Z50mm ■ Optimized pattern recognition *For more details, please refer to the PDF document or feel free to contact us.

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The high-speed fully automatic dual-head wedge bonder Bondjet BJ931 meets the latest technologies and various demands for automotive products and power semiconductors. It supports aluminum wire, copper wire, gold wire, and ribbon, and the bond head can be replaced in just a few minutes. With a robust and clean design, the industry's largest bonding area, long maintenance intervals, user-friendly software, and support features, the Bondjet BJ931 can also be equipped with Hesse Mechatronics' industry-leading process monitoring system PiQC.

• Bonding Equipment