An innovative technology that heats the bond, making it easier to wedge bond copper wire.
Fully automatic wedge bonder equipped with a heating function. It supplies laser energy to the tool tip via a beam trap. By using a laser-heated bond tool for ultrasonic wire bonding, it improves joint quality. Localized heating occurs simultaneously with cooling, preventing oxidation of the surrounding area. Heating allows bonding with lower load and lower power, enabling wedge bonding of copper wire to chips with thinner pad thickness. Improved bond quality can also enhance yield.
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basic information
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Power modules for automotive and industrial use, batteries for BEVs, etc. *For more details, please refer to the PDF document or feel free to contact us.
Company information
Hesse Mechatronics Japan Co., Ltd. is a wholly-owned subsidiary of Hesse GmbH, headquartered in Paderborn, Germany. We primarily develop, manufacture, and sell fine and heavy wire wedge bonders. In Japan, we have delivered over 200 units to date (including deliveries to overseas factories of Japanese customers), and with the aim of providing better support to our Japanese customers from the development stage to mass production, we established our Japanese corporation in 2014. For any inquiries regarding wire bonding, whether it be fine wire, heavy wire, ribbon, aluminum wire, gold wire, copper wire, clad wire, or other wire materials, please feel free to contact us. Hesse GmbH is located in Paderborn, Germany. Since 1986, it has primarily manufactured and sold conveyor systems for factory automation. In 1995, it began manufacturing and selling high-performance semiconductor manufacturing equipment, and to date, it has delivered to over 280 companies and more than 1,200 units. Customers worldwide receive sales and support from our headquarters in Germany, our subsidiaries in Japan, Hong Kong, and the United States, as well as from local agents in over 30 countries.
