Fully Automatic Thick Line Wedge Bonder for Aerospace Applications
BJ955、BJ959、BJ985
The optimal bonding solution for the aerospace field, which requires high reliability.
In the aerospace field, reliable and stable bonding technology is essential for the manufacturing of components that require extremely high reliability. In particular, products that must withstand harsh environments demand precise bonding where even minute defects are unacceptable. Our fully automatic fine wire wedge bonders BJ955/BJ959/BJ985 provide advanced bonding solutions to meet these stringent requirements. 【Application Scenarios】 - Manufacturing of electronic devices for aircraft - Joining of components for space equipment - Assembly of sensors that require high reliability 【Benefits of Implementation】 - Improved reliability of joints - Stabilization of the manufacturing process - Strengthening of quality control
Inquire About This Product
basic information
【Features】 ■ Bond Head: Compatible with aluminum, copper, and aluminum-copper clad from 50um to 600um, ribbon up to 2,000um x 400um ■ Improved wire handling: Reduced distance between bond head and spool ■ Optimized and accelerated image recognition: Imaging with a new digital camera and flashlight ■ Bond tool calibration without the need for fixtures ■ Fully automatic load calibration 【Our Strengths】 Hesse Mechatronics Japan Co., Ltd. is a 100% subsidiary of Hesse GmbH based in Germany, and has been developing, manufacturing, and selling high-performance semiconductor manufacturing equipment and welding machines for electric vehicle battery modules for many years. We have delivered over 400 units in Japan and provide customer support from the development stage to mass production. Our wire bonding technology meets customer needs with various wire materials including fine wires, thick wires, ribbons, aluminum, gold, copper, and clad. We contribute to a wide range of industries, including aerospace, semiconductors, automotive, and defense.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs
Company information
Hesse Mechatronics Japan Co., Ltd. is a wholly-owned subsidiary of Hesse GmbH, headquartered in Paderborn, Germany. We primarily develop, manufacture, and sell fine and heavy wire wedge bonders. In Japan, we have delivered over 200 units to date (including deliveries to overseas factories of Japanese customers), and with the aim of providing better support to our Japanese customers from the development stage to mass production, we established our Japanese corporation in 2014. For any inquiries regarding wire bonding, whether it be fine wire, heavy wire, ribbon, aluminum wire, gold wire, copper wire, clad wire, or other wire materials, please feel free to contact us. Hesse GmbH is located in Paderborn, Germany. Since 1986, it has primarily manufactured and sold conveyor systems for factory automation. In 1995, it began manufacturing and selling high-performance semiconductor manufacturing equipment, and to date, it has delivered to over 280 companies and more than 1,200 units. Customers worldwide receive sales and support from our headquarters in Germany, our subsidiaries in Japan, Hong Kong, and the United States, as well as from local agents in over 30 countries.
