Easier wedge bonding of copper wire using heating technology.
In the automotive parts industry, reliable connections such as sensor wiring are required. In particular, the bonding of copper wire to chips with thin pad thickness requires high technology and precise control. Improper bonding can lead to decreased product performance and failures. Our Laser Sonic copper wire wedge bonder addresses these challenges with innovative heating technology. 【Application Scenarios】 - Wedge bonding of copper wire in sensor wiring - Bonding to chips with thin pad thickness - Improving reliability of automotive parts 【Benefits of Implementation】 - Improved bondability - Achieving bonds with low load and low power - Improved yield due to enhanced bond quality
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basic information
【Features】 - Fully automatic wedge bonder equipped with heating function - Supplies laser energy to the tool tip via a beam trap - Performs ultrasonic wire bonding with a laser-heated bond tool - Suppresses oxidation in the surrounding area by local heating while cooling - Allows bonding with low load and low power 【Our Strengths】 Hesse Mechatronics Japan Co., Ltd. is the Japanese subsidiary of Hesse GmbH in Germany, developing, manufacturing, and selling wedge bonders for fine wires, thick wires, and ribbons, as well as ball bonders, ultrasonic welding machines, and laser welding machines. We have delivered over 400 units within Japan and support our customers from the development stage to mass production. We provide bonding equipment across a wide range of industries, including semiconductors, automotive, eco-friendly vehicles such as BEVs, and aerospace, responding to diverse customer needs. We can offer one-stop solutions for various bonding applications.
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Power modules for automotive and industrial use, batteries for BEVs, etc. *For more details, please refer to the PDF document or feel free to contact us.
Company information
Hesse Mechatronics Japan Co., Ltd. is a wholly-owned subsidiary of Hesse GmbH, headquartered in Paderborn, Germany. We primarily develop, manufacture, and sell fine and heavy wire wedge bonders. In Japan, we have delivered over 200 units to date (including deliveries to overseas factories of Japanese customers), and with the aim of providing better support to our Japanese customers from the development stage to mass production, we established our Japanese corporation in 2014. For any inquiries regarding wire bonding, whether it be fine wire, heavy wire, ribbon, aluminum wire, gold wire, copper wire, clad wire, or other wire materials, please feel free to contact us. Hesse GmbH is located in Paderborn, Germany. Since 1986, it has primarily manufactured and sold conveyor systems for factory automation. In 1995, it began manufacturing and selling high-performance semiconductor manufacturing equipment, and to date, it has delivered to over 280 companies and more than 1,200 units. Customers worldwide receive sales and support from our headquarters in Germany, our subsidiaries in Japan, Hong Kong, and the United States, as well as from local agents in over 30 countries.
