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  6. Fully Automatic Thick Wire Wedge Bonder for Automotive Powertrains

Fully Automatic Thick Wire Wedge Bonder for Automotive Powertrains

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BJ955、BJ959、BJ985

last updated:Sep 24, 2026

Hesse Mechatronics Japan Co.,Ltd.
Hesse Mechatronics Japan Co.,Ltd.
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Achieving high-quality bonds optimized for automotive powertrains.

In the automotive powertrain field, the bonding of components that require high reliability and durability is essential. Particularly in onboard applications and battery modules used in harsh environments, reliable and stable bonding directly impacts the maintenance of product performance. Inadequate bonding can lead to component failures, performance degradation, and even issues related to the overall reliability of the vehicle. Our fully automatic fine wire wedge bonders BJ955/BJ959/BJ985 have been developed to meet these demands. 【Application Scenarios】 - Wiring bonding for onboard applications - Busbar connections within battery modules - Lead frame connections in power modules 【Benefits of Implementation】 - Improved product lifespan through reliable bonding - Enhanced overall vehicle reliability through stable performance maintenance - Increased production efficiency through automation

    Bonding Equipment
BJ955959985.png

Fully Automatic Thick Wire Wedge Bonder for Automotive Powertrains

BJ955959985.png
BJ955959985.png
  • Related Link - https://www.hesse-mechatronics.com/en/bondjet-bj95…
  • Special site - Product/service details - https://pr.mono.ipros.com/hesse/product/

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【Features】 ■Compatible wire sizes: From 50μm to 600μm, supporting aluminum, copper, and aluminum-copper clad. Ribbons can be accommodated up to 2,000μm x 400μm. ■Improved wire handling: Shortening the distance between the bond head and the spool enables smooth wire supply. ■Optimized and accelerated image recognition: Rapid and accurate image recognition is achieved with a new digital camera and flashlight. ■Bond tool calibration without fixtures: Reduces setup hassle. ■Fully automatic load calibration: Maintains optimal bonding load at all times. ■High-precision programmable bond force actuator: Enables precise bonding control. 【Our Strengths】 Hesse Mechatronics Japan Co., Ltd. develops, manufactures, and sells fine wire and heavy wire wedge bonders, ball bonders, ultrasonic welding machines, and laser welding machines. We support our customers from the development stage to mass production. We have numerous achievements in welding machines for battery modules and power modules for BEVs and HEVs, and we can respond to various bonding requests in a one-stop manner.

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Hesse

Hesse Mechatronics Japan Co.,Ltd.

Industrial Machinery

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Hesse Mechatronics Japan Co., Ltd. is a wholly-owned subsidiary of Hesse GmbH, headquartered in Paderborn, Germany. We primarily develop, manufacture, and sell fine and heavy wire wedge bonders. In Japan, we have delivered over 200 units to date (including deliveries to overseas factories of Japanese customers), and with the aim of providing better support to our Japanese customers from the development stage to mass production, we established our Japanese corporation in 2014. For any inquiries regarding wire bonding, whether it be fine wire, heavy wire, ribbon, aluminum wire, gold wire, copper wire, clad wire, or other wire materials, please feel free to contact us. Hesse GmbH is located in Paderborn, Germany. Since 1986, it has primarily manufactured and sold conveyor systems for factory automation. In 1995, it began manufacturing and selling high-performance semiconductor manufacturing equipment, and to date, it has delivered to over 280 companies and more than 1,200 units. Customers worldwide receive sales and support from our headquarters in Germany, our subsidiaries in Japan, Hong Kong, and the United States, as well as from local agents in over 30 countries.

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