Fully Automatic Thick Wire Wedge Bonder for Medical Devices
BJ955、BJ959、BJ985
High-precision bonding solutions that meet miniaturization needs.
In the medical device industry, there is a demand for miniaturization of products and high reliability. In particular, the precise joining of fine components is essential for maintaining the performance and safety of the devices. Improper joining can lead to device failure or performance degradation. Our fully automatic fine wire wedge bonders BJ955/BJ959/BJ985 address these challenges and contribute to the miniaturization and high precision of medical devices. 【Application Scenarios】 - Circuit board assembly for small medical devices - Joining of fine components such as catheters and sensors - Manufacturing of implantable devices 【Benefits of Implementation】 - Support for miniaturization design of products - Improved reliability through high-precision bonding - Enhanced production efficiency
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basic information
**Features** - Bond head compatible with a wide range of wire sizes from 50um to 600um (supports aluminum, copper, aluminum-copper clad, ribbon up to 2,000um x 400um) - Reduced distance between bond head and spool due to improved wire handling - Optimized and accelerated image recognition (imaging with new digital camera and flashlight) - Bond tool calibration without the need for fixtures - Fully automatic load calibration - High-precision programmable bond force actuator **Our Strengths** Hesse Mechatronics Japan Co., Ltd. is a 100% subsidiary of Hesse GmbH based in Germany, developing, manufacturing, and selling wedge bonders, ball bonders, ultrasonic welding machines, and laser welding machines for fine wire, thick wire, and ribbon. We have a track record of over 400 units delivered within Japan and provide customer-oriented support from the development stage to mass production. We are capable of addressing all inquiries related to wire bonding.
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Company information
Hesse Mechatronics Japan Co., Ltd. is a wholly-owned subsidiary of Hesse GmbH, headquartered in Paderborn, Germany. We primarily develop, manufacture, and sell fine and heavy wire wedge bonders. In Japan, we have delivered over 200 units to date (including deliveries to overseas factories of Japanese customers), and with the aim of providing better support to our Japanese customers from the development stage to mass production, we established our Japanese corporation in 2014. For any inquiries regarding wire bonding, whether it be fine wire, heavy wire, ribbon, aluminum wire, gold wire, copper wire, clad wire, or other wire materials, please feel free to contact us. Hesse GmbH is located in Paderborn, Germany. Since 1986, it has primarily manufactured and sold conveyor systems for factory automation. In 1995, it began manufacturing and selling high-performance semiconductor manufacturing equipment, and to date, it has delivered to over 280 companies and more than 1,200 units. Customers worldwide receive sales and support from our headquarters in Germany, our subsidiaries in Japan, Hong Kong, and the United States, as well as from local agents in over 30 countries.
