Fully Automatic Thick Wire Wedge Bonder for Semiconductor Packages
BJ955、BJ959、BJ985
Providing optimal and high-quality bonding that supports multi-pin configurations.
In the semiconductor packaging industry, as the trend towards multi-pin configurations progresses, there is a demand for high-density and highly reliable bonding. Particularly when connecting numerous leads or chips, precise positioning and stable joints are directly linked to the product's performance and durability. Improper bonding can lead to signal degradation or product failure. The fully automatic thick wire wedge bonders BJ955/BJ959/BJ985 were developed to meet these needs. 【Application Scenarios】 - Manufacturing of semiconductor packages with increasing pin counts - Bonding of substrates for automotive applications - Connections to large substrates such as battery modules - Manufacturing of electronic components requiring high-density mounting 【Benefits of Implementation】 - Supports a wide range of wire sizes to meet the demands of multi-pin configurations - Accurate bonding through high-speed and high-precision image recognition - Reduced setup time due to automatic calibration features - Reliability backed by extensive track record in EV battery modules
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basic information
【Features】 - Supports a wide range of wire sizes from 50μm to 600μm (aluminum, copper, aluminum-copper clad), with ribbons up to 2,000μm x 400μm. - Shortens the distance between the bond head and the spool, improving wire handling. - Optimized and accelerated image recognition using a new digital camera and flashlight. - Bond tool calibration function that does not require fixtures. - Fully automatic load calibration function. - High-precision programmable bond force actuator. - Extensive track record for EV battery modules. 【Our Strengths】 Hesse Mechatronics Japan Co., Ltd. develops, manufactures, and sells wedge bonders, ball bonders, ultrasonic welding machines, and laser welding machines for fine wires, thick wires, and ribbons. We have delivered over 400 units in Japan and provide customer support from the development stage to mass production. We can address all inquiries related to wire bonding. Additionally, we have a strong track record with ultrasonic and laser welding machines for battery modules used in BEVs and HEVs, offering one-stop solutions for various joining needs.
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Company information
Hesse Mechatronics Japan Co., Ltd. is a wholly-owned subsidiary of Hesse GmbH, headquartered in Paderborn, Germany. We primarily develop, manufacture, and sell fine and heavy wire wedge bonders. In Japan, we have delivered over 200 units to date (including deliveries to overseas factories of Japanese customers), and with the aim of providing better support to our Japanese customers from the development stage to mass production, we established our Japanese corporation in 2014. For any inquiries regarding wire bonding, whether it be fine wire, heavy wire, ribbon, aluminum wire, gold wire, copper wire, clad wire, or other wire materials, please feel free to contact us. Hesse GmbH is located in Paderborn, Germany. Since 1986, it has primarily manufactured and sold conveyor systems for factory automation. In 1995, it began manufacturing and selling high-performance semiconductor manufacturing equipment, and to date, it has delivered to over 280 companies and more than 1,200 units. Customers worldwide receive sales and support from our headquarters in Germany, our subsidiaries in Japan, Hong Kong, and the United States, as well as from local agents in over 30 countries.
