Notice of Participation in Internepcon 2018: Solder Jet Demonstration! Free Samples for the First Visitors

Achieving high precision/high-speed processing (linear drive: ±5μm)! Proposing high precision/high functionality in the implementation of smartphone components and the flip chip field!

Sinwa Ultra-Precision Dispenser 【MsL】 - Semiconductor back-end processes (mainly Flip-chip Underfill) → Achieves high precision/high-speed processing! (X-Y repeat accuracy: ±5μm) → Reduction in the number of equipment investments through high-speed dispensing (Equipped with jet pump or screw pump) → Improved stability of application amount due to room temperature discharge! → Significant reduction in yield loss, greatly improved production efficiency 【Applications】 ◆ Flip-chip Underfill ◆ MEMS & HDD ◆ General LED phosphors (SMD/side view/Dam & Fill, etc.) ◆ Cream solder (MIN: φ150μm) ◆ Ag paste ◆ UV curing resin, among others

• Circuit board processing machine

Achieving ultra-precise dispensing through screw rotation! Extensive track record and versatility in LED/line coating/3D coating!

【Dispensing Industry Achieves Capability No.1】 Shinwa Screw Dispenser - LED Post-Processing / PCB Assembly Process ▶ Adjustment of dispensing amount based on screw rotation (Compatible with high-viscosity materials) ▶ Reduction in the number of equipment investments through high-speed dispensing (Compared to air dispensers: 2 to 5 times processing capacity) ▶ Increased stability of dispensing amount through room temperature discharge ▶ Significant reduction in yield loss, increased production efficiency! 【Applications】 ■ Secondary Underfill ■ LED Phosphors (General) (SMD/Side View/Dam & Fill, etc.) ■ Cream Solder (φ250~φ300μm) * The dispensing diameter may vary depending on the solder particles used. ■ Ag Paste ■ UV Curing Resin, among others.

• Bonding Equipment

Attention smartphone component manufacturers and PCB assembly manufacturers! We are offering a free technical document featuring examples of improvements using the jet dispense method.

This document provides detailed foundational knowledge and mechanisms for solving dispensing position issues, accommodating uneven substrates, and improving yield by switching from the "screen printing method" to the "solder jet dispense method." It serves as a textbook-like resource that can address various problems faced by production sites. 【Target Audience】 Printed circuit board manufacturers, various module manufacturers, implementation in three-dimensional structures, FPC manufacturers, etc. 【Contents】 ■ Advantages / Disadvantages of the screen printing method ■ List of technologies made possible by jet dispensers ■ List of applied products (target applications) *For more details, please refer to the PDF document or contact us directly.

• Circuit board processing machine

Achieving improved production efficiency with high-speed ejection compatible with φ150μm and φ110μm dots.

The JET Dispenser 'SPJ-22A' from Shinwa boasts top-class performance in the dispensing industry. Even with continuous operation, the application shape remains stable, enabling production that maintains high quality and high precision. It achieves industry-leading micro-dispensing with dot sizes of φ150μm and φ110μm. It is adaptable to various materials, but particularly excels with cream solder, having a wealth of proven results. Being non-contact, it is suitable for a wide range of applications. We also conduct free sample tests regularly, so please feel free to contact us. 【Application Products】 ■ Flexible substrates (difficult-to-print bases such as warping and expansion) ■ Component mounting inside connectors (three-dimensional structures) ■ 0402/0201 chip component mounting ■ Various modules / LED modules, etc. 【Main Contents of Free Sample Tests】 ■ Dispensing weight accuracy / Dispensing shape / Cycle time, etc. *For more details, please refer to the PDF materials or contact us directly.

• Circuit board processing machine

Application of LED lens mold using a dispenser. Developed a new method! Successful cost reduction due to mold-less production!

- LED post-process / substrate mounting process → Adjustment of application amount based on screw rotation (Compatible with high-viscosity materials) → Reduction in the number of equipment investments through high-speed dispensing (Compared to air dispensers: 3 to 8 times processing capacity) → Increased stability of application amount through room temperature discharge! → Significant reduction in yield loss, increased production efficiency!

• Assembly Machine

The definitive low-cost dispenser that maintains high precision! Significant increase in production efficiency with high-speed dispensing! Ideal for solving coating issues in manufacturing sites!

☆☆☆Shinwa Precision Dispenser GP2☆☆☆ - Circuit Board Assembly Process & Post-LED Process → Achieves high precision and high-speed processing! (X-Y repeat accuracy: ±30μm) → Reduction in the number of equipment investments through high-speed dispensing (Equipped with jet pump or screw pump) → Improved stability of application amount due to room temperature discharge! → Significant reduction in yield loss and substantial increase in production efficiency 【Applications】 ◆ General LED phosphors (SMD/Side View/Dam & Fill, etc.) ◆ Cream solder ◆ Ag paste ◆ UV curing resin　　　　　　　　　　　　　　Others

• Bonding Equipment

【Top-Class Capability in the Coating Industry】 Achieved cream solder φ150μm! X-Y axis repeatability ±10μm Supports high-density mounting!

☆☆☆ Shinwa Ultra-Precision Dispenser MsB ☆☆☆ - LED Post-Processing / Semiconductor Post-Processing → Achieves high precision and high-speed processing! (X-Y Repetition Accuracy: ±10μm) → Reduction in the number of equipment investments through high-speed dispensing (Equipped with jet pump or screw pump) → Increased stability of application amount through room temperature discharge! → Significant reduction in yield loss and substantial increase in production efficiency 【Applications】 ◆ Flip-chip Underfill / BGA Underfill ◆ General LED Phosphors (SMD/Side View/Dam & Fill, etc.) ◆ Cream Solder (MIN: φ150μm) ◆ Ag Paste (MIN: φ120μm) ◆ UV Curing Resin, etc.

• Assembly Machine

World-class 0.001mg / Successful high-speed coating! Versatility in dispensing processes across various industries

【Top-Class Capability in the Dispensing Industry】 - Semiconductor back-end process / LED back-end process → Supports high-density mounting. Achieves micro-dispensing in extremely small spaces. → Reduces the number of equipment investments through high-speed dispensing. → Increases stability of dispensing amount with room temperature discharge! → Significantly reduces yield loss and improves production efficiency! 【Applications】 ◆ Flip-chip Underfill ◆ General LED Phosphors (SMD/Side View/Flip-chip LED, etc.) ◆ Cream Solder ◆ Ag Paste ◆ Moisture-proof materials (Conformal Coating) ◆ UV Curing Resin　　　　　　　　　　　　　　 Others

• Special Pump

On September 15, 2026, we issued a press release regarding the wooden lightweight sheet "Hyper CLT Sheet." The Hyper CLT Sheet is a civil engineering sheet that utilizes CLT (Cross-Laminated Timber) stacked in an orthogonal direction. It can be used in various locations such as temporary roads, access routes, heavy machinery work yards, and material storage areas. The 5×10 version weighs approximately 230 kg, making it relatively lightweight and easy to install, remove, and relocate. Additionally, it offers environmental benefits such as reducing glare and metallic sounds typical of wood, as well as CO2 fixation. Furthermore, it can be proposed for the use of new technologies in public works as a **registered technology with the Ministry of Land, Infrastructure, Transport and Tourism "TH-250021-A."** Through this press release, we aim to expand the new wooden lightweight sheet that combines wood, NETIS, civil engineering, and CLT to more construction sites.

● The production time for cast prototypes can be shortened! Since model making is not required, the production time for prototypes, which previously took about a month, can be significantly reduced. ● Model costs can be reduced! By directly producing sand molds from 3D data, there is no need for model production costs. If changes to the model are necessary, they can be addressed by modifying the 3D data. ● Similar products with different shapes and dimensions can be prototyped simultaneously! Different products, such as similar shapes or varying dimensions, can be molded at the same time in one molding process. This allows for the verification of multiple types in a short period.

The "HA-T Series" is an energy-saving automatic door sensor that opens only for those who wish to enter, whether on a busy street or in a narrow passageway. The automatic door opens simply by bringing your hand close, addressing hygiene concerns even in facilities used by a large number of people. You can choose between "Non-vision Mount Type/HA-T401" and "Non-vision Built-in Type/HA-T520" depending on the application and installation location. 【Recommended for such places!】 ☑ Entrance facing a busy corridor ☑ Presence of counters or signs near the door ☑ Buildings facing narrow passages ☑ Buildings that prioritize aesthetics ☑ Hospitals and facilities that consider hygiene ☑ Large facilities with many doors 【Features】 ● Adaptable to various door types with four detection spot settings ● Reduces unnecessary opening and closing, contributing to energy-saving by minimizing wasteful power consumption ● Equipped with a light touch function, allowing the door to open and close just by waving your hand, ensuring hygiene ● Can also be used as a wide detection range non-vision infrared sensor ◎ For more details, please download the materials or contact us.

Metal cracks are one of the concerns in equipment maintenance operations. Repairs using conventional welding methods often change the base material around the crack due to heat, leading to residual stress and deformation, which constantly carries the risk of "crack recurrence" and "secondary damage." Hinode Waterworks Equipment Co., Ltd.'s "Mechanical Stitching Method" is a new technique that allows for the repair of metal cracks without applying heat. By using special bolts and reinforcement plates, the crack is physically removed without affecting the base material at all. Repairs can be carried out even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. For more details, please contact us or download the catalog.

Metal cracks are one of the concerns in equipment maintenance operations. Repairs using conventional welding methods can alter the base material around the crack due to heat, leading to residual stress and deformation, which always carries the risk of "crack recurrence" or "secondary damage." Hinode Waterworks Equipment Co., Ltd.'s "Mechanical Stitching Method" is a new technique that allows for the repair of metal cracks without applying heat. By using special bolts and reinforcement plates, the crack is physically removed without affecting the base material with heat. Repairs can be performed even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. For more details, please contact us or download the catalog.