Video Release: Dispensing of Lens Molds for LEDs
Quspa-Screw
Application of LED lens mold using a dispenser. Developed a new method! Successful cost reduction due to mold-less production!
- LED post-process / substrate mounting process → Adjustment of application amount based on screw rotation (Compatible with high-viscosity materials) → Reduction in the number of equipment investments through high-speed dispensing (Compared to air dispensers: 3 to 8 times processing capacity) → Increased stability of application amount through room temperature discharge! → Significant reduction in yield loss, increased production efficiency!
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basic information
【Features】 ◆ Adjustment of application amount by screw rotation! (Application amount stability ◎) ◆ Achieves room temperature dispensing of high viscosity materials! → By adopting a screw method, it is possible to discharge high viscosity materials. (MAX: 500,000 mPa.s can be dispensed at room temperature) ◆ Realizes high-speed dispensing ◆ Adopts a one-touch replacement method, successfully reducing replacement time significantly! ◆ Compatibility with line coating (acceleration/deceleration, coating adjustment function for corners) ◆ Achieves low running costs ◆ Simple software program We offer free sample testing for those considering a purchase. For details, please request materials or refer to the catalog.
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Applications/Examples of results
【Application】 ◆BGA Underfill ◆LED Phosphor General (SMD/Side View/Dam & Fill, etc.) ◆Solder Paste (φ200μm~φ250μm) ※The application diameter is affected by the solder particles used. ◆Ag Paste Others
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We manufacture and sell dispenser devices that achieve high-speed and high-precision micro-dispensing on a wide range of materials and substrates. With sales networks in 19 locations in Japan and 12 overseas, we propose dispensing solutions to be a closer presence for our customers.
