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  1. Home
  2. Industrial Machinery
  3. Shinwa Co., Ltd. Mechatronics System Center
  4. Free sample testing currently in progress
EVENT
  • Aug 01, 2017
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Aug 01, 2017

Free sample testing currently in progress

Shinwa Co., Ltd. Shinwa Co., Ltd. Mechatronics System Center
Good news for those who are seeking to identify issues and improvements in the dispensing process! Our company is conducting free sample tests on an ongoing basis to improve users' coating problems. In particular, we can provide the best match proposals for users who require coating heads suitable for high-viscosity materials and have strict demands for coating position accuracy! The main contents of the implementation include: - Coating weight accuracy evaluation - Coating shape evaluation - Cycle time evaluation We will compare these with existing equipment. Later, we will submit a coating evaluation report aimed at solving your company's issues! <Contact Information> Shinwa Co., Ltd. Mechatronics System Center Contact: Ozawa TEL: 052-739-0175 E-Mail: kenji-ozawa@shinwa-jpn.co.jp
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Ultra-Precision dispensing Device MsL [Smartphone Component Assembly/Flip Chip]

Achieving high precision/high-speed processing (linear drive: ±5μm)! Proposing high precision/high functionality in the implementation of smartphone components and the flip chip field!

Sinwa Ultra-Precision Dispenser 【MsL】 - Semiconductor back-end processes (mainly Flip-chip Underfill) → Achieves high precision/high-speed processing! (X-Y repeat accuracy: ±5μm) → Reduction in the number of equipment investments through high-speed dispensing (Equipped with jet pump or screw pump) → Improved stability of application amount due to room temperature discharge! → Significant reduction in yield loss, greatly improved production efficiency 【Applications】 ◆ Flip-chip Underfill ◆ MEMS & HDD ◆ General LED phosphors (SMD/side view/Dam & Fill, etc.) ◆ Cream solder (MIN: φ150μm) ◆ Ag paste ◆ UV curing resin, among others

  • Circuit board processing machine

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Screw dispenser [LED post-process / board mounting]

Achieving ultra-precise dispensing through screw rotation! Extensive track record and versatility in LED/line coating/3D coating!

【Dispensing Industry Achieves Capability No.1】 Shinwa Screw Dispenser - LED Post-Processing / PCB Assembly Process ▶ Adjustment of dispensing amount based on screw rotation (Compatible with high-viscosity materials) ▶ Reduction in the number of equipment investments through high-speed dispensing (Compared to air dispensers: 2 to 5 times processing capacity) ▶ Increased stability of dispensing amount through room temperature discharge ▶ Significant reduction in yield loss, increased production efficiency! 【Applications】 ■ Secondary Underfill ■ LED Phosphors (General) (SMD/Side View/Dam & Fill, etc.) ■ Cream Solder (φ250~φ300μm) * The dispensing diameter may vary depending on the solder particles used. ■ Ag Paste ■ UV Curing Resin, among others.

  • Bonding Equipment

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Hot melt dispenser

A dispenser compatible with all hot melt materials has finally arrived!

Dot dispensing, free line dispensing, and circular dispensing compatible 【Features】 ■ Achieves dispensing of φ0.20 mm or less ■ Realizes high-speed dispensing with piezoelectric drive system ■ Achieves low running costs 【Introduction of some contents of free sample test】 ■ Dispensing weight accuracy / Dispensing shape / Cycle time, etc. *For more details, please refer to the PDF document or contact us directly.

  • Circuit board processing machine

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Jet dispenser for cream solder application

Achieving improved production efficiency with high-speed ejection compatible with φ150μm and φ110μm dots.

The JET Dispenser 'SPJ-22A' from Shinwa boasts top-class performance in the dispensing industry. Even with continuous operation, the application shape remains stable, enabling production that maintains high quality and high precision. It achieves industry-leading micro-dispensing with dot sizes of φ150μm and φ110μm. It is adaptable to various materials, but particularly excels with cream solder, having a wealth of proven results. Being non-contact, it is suitable for a wide range of applications. We also conduct free sample tests regularly, so please feel free to contact us. 【Application Products】 ■ Flexible substrates (difficult-to-print bases such as warping and expansion) ■ Component mounting inside connectors (three-dimensional structures) ■ 0402/0201 chip component mounting ■ Various modules / LED modules, etc. 【Main Contents of Free Sample Tests】 ■ Dispensing weight accuracy / Dispensing shape / Cycle time, etc. *For more details, please refer to the PDF materials or contact us directly.

  • Circuit board processing machine

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Video Release: Dispensing of Lens Molds for LEDs

Application of LED lens mold using a dispenser. Developed a new method! Successful cost reduction due to mold-less production!

- LED post-process / substrate mounting process → Adjustment of application amount based on screw rotation (Compatible with high-viscosity materials) → Reduction in the number of equipment investments through high-speed dispensing (Compared to air dispensers: 3 to 8 times processing capacity) → Increased stability of application amount through room temperature discharge! → Significant reduction in yield loss, increased production efficiency!

  • Assembly Machine

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Precision Dispenser Device GP2 [Board Mounting/LED Post-Processing]

The definitive low-cost dispenser that maintains high precision! Significant increase in production efficiency with high-speed dispensing! Ideal for solving coating issues in manufacturing sites!

☆☆☆Shinwa Precision Dispenser GP2☆☆☆ - Circuit Board Assembly Process & Post-LED Process → Achieves high precision and high-speed processing! (X-Y repeat accuracy: ±30μm) → Reduction in the number of equipment investments through high-speed dispensing (Equipped with jet pump or screw pump) → Improved stability of application amount due to room temperature discharge! → Significant reduction in yield loss and substantial increase in production efficiency 【Applications】 ◆ General LED phosphors (SMD/Side View/Dam & Fill, etc.) ◆ Cream solder ◆ Ag paste ◆ UV curing resin              Others

  • Bonding Equipment

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Precision Dispenser Device Quspa-MsB [Solder Jet Compatible]

【Top-Class Capability in the Coating Industry】 Achieved cream solder φ150μm! X-Y axis repeatability ±10μm Supports high-density mounting!

☆☆☆ Shinwa Ultra-Precision Dispenser MsB ☆☆☆ - LED Post-Processing / Semiconductor Post-Processing → Achieves high precision and high-speed processing! (X-Y Repetition Accuracy: ±10μm) → Reduction in the number of equipment investments through high-speed dispensing (Equipped with jet pump or screw pump) → Increased stability of application amount through room temperature discharge! → Significant reduction in yield loss and substantial increase in production efficiency 【Applications】 ◆ Flip-chip Underfill / BGA Underfill ◆ General LED Phosphors (SMD/Side View/Dam & Fill, etc.) ◆ Cream Solder (MIN: φ150μm) ◆ Ag Paste (MIN: φ120μm) ◆ UV Curing Resin, etc.

  • Assembly Machine

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Sinwa Jet Pump (High Viscosity / High Speed Discharge / Ultra Micro) QJC3280F

World-class 0.001mg / Successful high-speed coating! Versatility in dispensing processes across various industries

【Top-Class Capability in the Dispensing Industry】 - Semiconductor back-end process / LED back-end process → Supports high-density mounting. Achieves micro-dispensing in extremely small spaces. → Reduces the number of equipment investments through high-speed dispensing. → Increases stability of dispensing amount with room temperature discharge! → Significantly reduces yield loss and improves production efficiency! 【Applications】 ◆ Flip-chip Underfill ◆ General LED Phosphors (SMD/Side View/Flip-chip LED, etc.) ◆ Cream Solder ◆ Ag Paste ◆ Moisture-proof materials (Conformal Coating) ◆ UV Curing Resin               Others

  • Special Pump

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Shinwa Co., Ltd.
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Please let us know your concerns regarding leaks. We may have some suggestions for you. Leak tests, leakage tests, leak inspections, leak detection, container integrity tests, packaging integrity tests...

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Fukuda Corporation has been pursuing leak detection for 60 years and is dedicated to advancing the future of leak testing. 【 Supporting Various Leak Tests: Air Leak Test / Gas Leak Test (Hydrogen Gas, Helium Gas) 】 We develop, manufacture, and sell leak testing equipment to inspect airtightness and sealing performance. We will propose suitable testers and devices for each inspection target. 【 Target Industries and Examples of Inspection Targets 】 - Automotive Industry: Engines, FC components, valves and piping, various parts - Electronic Components Industry: Smartphones, keyless switches, various small sensors - Pharmaceuticals / Food / Cosmetics Industry: Bottle containers, syringes, vials, eye drop containers, pillow packaging, PTP packaging We will propose the most suitable leak testers for each industry. 【 ISO Certification 】JIS Q 9001:2015 (ISO 9001:2015)

Aug 19, 2026

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Fukuda's Technology Column

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This is a collection of links to Fukuda's technical columns. It covers various topics related to leak tests and more... Please check the related links for more information.

Aug 19, 2026

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Hyper CLT flooring panel

Wooden planks for leveling an unpaved temporary parking lot | Hyper CLT planks

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At construction sites, temporary parking lots may be established for workers and construction-related vehicles. On unpaved ground, mud and ruts can easily occur due to rain, which may hinder vehicle access. Hyper CLT mats are civil engineering materials that utilize wood CLT. By laying them in temporary parking lots, a suitable environment for vehicle passage and parking can be created while protecting the ground. They can be laid only in the necessary areas, and after the construction is completed, they can be removed and repurposed for temporary roads or access routes. The 5×10 panels weigh approximately 230 kg, and the 5×20 panels weigh about 460 kg, making them lightweight and easy to install and remove even with small machinery, allowing for changes in parking space. Additionally, they offer benefits unique to wood, such as glare reduction, noise reduction, and CO2 fixation. They are registered as a technology with the Ministry of Land, Infrastructure, Transport and Tourism under NETIS as "TH-250021-A," and can be utilized for the development of temporary parking lots and innovative public works.

Aug 19, 2026

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Metal Crack Repair: MS Method for Repairing Cracks and Fractures in Machinery Equipment

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Metal cracks are one of the concerns in equipment maintenance operations. Conventional welding repair methods can change the base material around the crack due to heat, leading to residual stress and deformation, which always carries the risk of "crack recurrence" and "secondary damage." Hinode Water Supply Equipment Co., Ltd.'s "Mechanical Stitching Method" is a new technique that allows for the repair of metal cracks without applying heat. By using special bolts and reinforcement plates, the crack is physically removed without affecting the base material at all. Repairs can be made even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. For more details, please contact us or download the catalog.

Aug 19, 2026

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Metal Crack Repair: MS Method for Repairing Cracks and Fractures in Machinery Equipment

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  • CATALOG

Metal cracks are one of the concerns in equipment maintenance operations. Conventional welding repair methods can alter the base material around the crack due to heat, leading to residual stress and deformation, which always carries the risk of "crack recurrence" or "secondary damage." Hinode Water Supply Equipment Co., Ltd.'s "Mechanical Stitching Method" is a new technique that allows for metal crack repair without applying heat. By using special bolts and reinforcement plates, the crack is physically removed without affecting the base material with heat. Repairs can be made even in environments where open flames cannot be used. Since no heat is applied, the disassembly of equipment is minimized. For more details, please contact us or download the catalog.

Aug 18, 2026

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