Precision Dispenser Device Quspa-MsB [Solder Jet Compatible]
Quspa-MsB
【Top-Class Capability in the Coating Industry】 Achieved cream solder φ150μm! X-Y axis repeatability ±10μm Supports high-density mounting!
☆☆☆ Shinwa Ultra-Precision Dispenser MsB ☆☆☆ - LED Post-Processing / Semiconductor Post-Processing → Achieves high precision and high-speed processing! (X-Y Repetition Accuracy: ±10μm) → Reduction in the number of equipment investments through high-speed dispensing (Equipped with jet pump or screw pump) → Increased stability of application amount through room temperature discharge! → Significant reduction in yield loss and substantial increase in production efficiency 【Applications】 ◆ Flip-chip Underfill / BGA Underfill ◆ General LED Phosphors (SMD/Side View/Dam & Fill, etc.) ◆ Cream Solder (MIN: φ150μm) ◆ Ag Paste (MIN: φ120μm) ◆ UV Curing Resin, etc.
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basic information
【Features】 ◆Device size: 1,300mm × 1,100mm × 1,380mm ◆Weight: Approximately 800kg ◆Power specifications: AC200V, 3-phase, 20A ◆Ball screw drive (±10μm) ◆Ultra-high precision image processing system (±1μm) Chip position inspection speed: 30 chips/sec ◆Non-contact height measurement function (laser method) ◆Target work size: MAX 250mm × 330mm MIN 50mm × 70mm ※If you wish to change the size, please consult separately. ◆Equipped with jet pump or screw pump ◎Coating temperature control system ◎Syringe temperature control system ◎Nozzle heating unit ◆Substrate heating unit can be installed ◆Simple software program ◆Simple inspection function (Dispense weight measurement - feedback function) (Coating area/coating height inspection - feedback function) Others ◆Supports three languages: Japanese/English/Chinese ☆We offer free sample tests for those considering a purchase☆ ☆For details, please request materials or refer to the catalog☆
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Applications/Examples of results
【Extensive Track Record in Various Industries/Materials】 Semiconductor Back-End Process ... Underfill/Dam & Fill Cream Solder/Ag Paste/UV Curing Resin, etc. LED Back-End Process ... General Phosphor Dispensing (SMD/PLCC/Dam & Fill, etc.) COB Packages (5mg to 360mg) PCB Assembly ... Cream Solder/Ag Paste/Moisture-Proof Materials/UV Curing Resin, etc. HDD Back-End Process ... Ag Paste/Thermosetting Resin/3D Dispensing, etc. MEMS ... Ag Nano Paste/UV Nano Paste, etc.
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Company information
We manufacture and sell dispenser devices that achieve high-speed and high-precision micro-dispensing on a wide range of materials and substrates. With sales networks in 19 locations in Japan and 12 overseas, we propose dispensing solutions to be a closer presence for our customers.
