Achieving improved production efficiency with high-speed ejection compatible with φ150μm and φ110μm dots.
The JET Dispenser 'SPJ-22A' from Shinwa boasts top-class performance in the dispensing industry. Even with continuous operation, the application shape remains stable, enabling production that maintains high quality and high precision. It achieves industry-leading micro-dispensing with dot sizes of φ150μm and φ110μm. It is adaptable to various materials, but particularly excels with cream solder, having a wealth of proven results. Being non-contact, it is suitable for a wide range of applications. We also conduct free sample tests regularly, so please feel free to contact us. 【Application Products】 ■ Flexible substrates (difficult-to-print bases such as warping and expansion) ■ Component mounting inside connectors (three-dimensional structures) ■ 0402/0201 chip component mounting ■ Various modules / LED modules, etc. 【Main Contents of Free Sample Tests】 ■ Dispensing weight accuracy / Dispensing shape / Cycle time, etc. *For more details, please refer to the PDF materials or contact us directly.
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basic information
Jet Dispenser - Semiconductor back-end process / LED back-end process → Supports high-density mounting → Achieves non-contact micro-dispensing on uneven substrates and in extremely small spaces → Reduces the number of equipment investments through high-speed dispensing → Increases stability of dispensing amount due to room temperature discharge → Significantly reduces yield loss and improves production efficiency *For more details, please refer to the PDF document or contact us directly.
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Applications/Examples of results
【Wide-ranging achievements in various industries/materials】 ● Semiconductor Backend ● Underfill / Dam & Fill / Cream Solder / Ag Paste / UV Curing Resin, etc. ● LED Backend ● General Phosphor Dispensing (SMD/PLCC/Dam & Fill, etc.) COB Packages (5mg to 360mg) ● PCB Assembly ● Cream Solder / Ag Paste / Moisture-proof Material / UV Curing Resin, etc. ● HDD Backend ● Ag Paste / Thermosetting Resin / 3D Dispensing, etc. ● MEMS ● Ag Nano Paste / UV Nano Paste, etc.
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Company information
We manufacture and sell dispenser devices that achieve high-speed and high-precision micro-dispensing on a wide range of materials and substrates. With sales networks in 19 locations in Japan and 12 overseas, we propose dispensing solutions to be a closer presence for our customers.
